JPS5724657B2 - - Google Patents

Info

Publication number
JPS5724657B2
JPS5724657B2 JP1966676A JP1966676A JPS5724657B2 JP S5724657 B2 JPS5724657 B2 JP S5724657B2 JP 1966676 A JP1966676 A JP 1966676A JP 1966676 A JP1966676 A JP 1966676A JP S5724657 B2 JPS5724657 B2 JP S5724657B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1966676A
Other languages
Japanese (ja)
Other versions
JPS52102673A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1966676A priority Critical patent/JPS52102673A/ja
Publication of JPS52102673A publication Critical patent/JPS52102673A/ja
Publication of JPS5724657B2 publication Critical patent/JPS5724657B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)
JP1966676A 1976-02-24 1976-02-24 Assembling of semiconductor device Granted JPS52102673A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1966676A JPS52102673A (en) 1976-02-24 1976-02-24 Assembling of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1966676A JPS52102673A (en) 1976-02-24 1976-02-24 Assembling of semiconductor device

Publications (2)

Publication Number Publication Date
JPS52102673A JPS52102673A (en) 1977-08-29
JPS5724657B2 true JPS5724657B2 (de) 1982-05-25

Family

ID=12005553

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1966676A Granted JPS52102673A (en) 1976-02-24 1976-02-24 Assembling of semiconductor device

Country Status (1)

Country Link
JP (1) JPS52102673A (de)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS519587A (en) * 1974-07-12 1976-01-26 Sharp Kk Handotaisochino seizoho

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS519587A (en) * 1974-07-12 1976-01-26 Sharp Kk Handotaisochino seizoho

Also Published As

Publication number Publication date
JPS52102673A (en) 1977-08-29

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