JPS5722885B2 - - Google Patents
Info
- Publication number
- JPS5722885B2 JPS5722885B2 JP1858774A JP1858774A JPS5722885B2 JP S5722885 B2 JPS5722885 B2 JP S5722885B2 JP 1858774 A JP1858774 A JP 1858774A JP 1858774 A JP1858774 A JP 1858774A JP S5722885 B2 JPS5722885 B2 JP S5722885B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/01—Manufacture or treatment
- H10W20/031—Manufacture or treatment of conductive parts of the interconnections
- H10W20/064—Manufacture or treatment of conductive parts of the interconnections by modifying the conductivity of conductive parts, e.g. by alloying
- H10W20/065—Manufacture or treatment of conductive parts of the interconnections by modifying the conductivity of conductive parts, e.g. by alloying by making at least a portion of the conductive part non-conductive, e.g. by oxidation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
- H10P14/6302—Non-deposition formation processes
- H10P14/6324—Formation by anodic treatments, e.g. anodic oxidation
Landscapes
- Weting (AREA)
- Compounds Of Alkaline-Earth Elements, Aluminum Or Rare-Earth Metals (AREA)
- ing And Chemical Polishing (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1858774A JPS5722885B2 (https=) | 1974-02-18 | 1974-02-18 | |
| US05/550,366 US4003772A (en) | 1974-02-18 | 1975-02-18 | Method for preparing thin film integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1858774A JPS5722885B2 (https=) | 1974-02-18 | 1974-02-18 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS50121197A JPS50121197A (https=) | 1975-09-22 |
| JPS5722885B2 true JPS5722885B2 (https=) | 1982-05-15 |
Family
ID=11975748
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1858774A Expired JPS5722885B2 (https=) | 1974-02-18 | 1974-02-18 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US4003772A (https=) |
| JP (1) | JPS5722885B2 (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57138191U (https=) * | 1981-02-20 | 1982-08-28 |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52914A (en) * | 1975-06-24 | 1977-01-06 | Tokyo Shibaura Electric Co | Chemical etching for surfaces of ceramic articles |
| US4146440A (en) * | 1978-04-03 | 1979-03-27 | Burroughs Corporation | Method for forming an aluminum interconnect structure on an integrated circuit chip |
| US4524378A (en) * | 1980-08-04 | 1985-06-18 | Hughes Aircraft Company | Anodizable metallic contacts to mercury cadmium telleride |
| US4589961A (en) * | 1984-08-31 | 1986-05-20 | Sperry Corporation | Aluminum mask anodization with lift-off for patterning Josephson junction devices |
| US4816895A (en) * | 1986-03-06 | 1989-03-28 | Nec Corporation | Integrated circuit device with an improved interconnection line |
| US5485019A (en) * | 1992-02-05 | 1996-01-16 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for forming the same |
| JPH07310191A (ja) * | 1994-05-11 | 1995-11-28 | Semiconductor Energy Lab Co Ltd | エッチング材料およびエッチング方法 |
| US6093631A (en) | 1998-01-15 | 2000-07-25 | International Business Machines Corporation | Dummy patterns for aluminum chemical polishing (CMP) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1910736C3 (de) * | 1969-03-03 | 1978-05-11 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Verfahren zum Herstellen von gegeneinander elektrisch isolierten, aus Aluminium bestehenden Leiterbahnen und Anwendung des Verfahrens |
| US3825453A (en) * | 1969-09-25 | 1974-07-23 | Motorola Inc | Method of preventing a chemical reaction between aluminum and silicon dioxide in a semiconductor device |
| US3723258A (en) * | 1970-12-14 | 1973-03-27 | Fairchild Camera Instr Co | Use of anodized aluminum as electrical insulation and scratch protection for semiconductor devices |
| US3756924A (en) * | 1971-04-01 | 1973-09-04 | Texas Instruments Inc | Method of fabricating a semiconductor device |
| JPS4995592A (https=) * | 1973-01-12 | 1974-09-10 | ||
| US3833434A (en) * | 1973-02-20 | 1974-09-03 | Hitachi Ltd | Method of forming multi-layer interconnections |
-
1974
- 1974-02-18 JP JP1858774A patent/JPS5722885B2/ja not_active Expired
-
1975
- 1975-02-18 US US05/550,366 patent/US4003772A/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57138191U (https=) * | 1981-02-20 | 1982-08-28 |
Also Published As
| Publication number | Publication date |
|---|---|
| US4003772A (en) | 1977-01-18 |
| JPS50121197A (https=) | 1975-09-22 |