JPS5721495A - Cutting agent - Google Patents

Cutting agent

Info

Publication number
JPS5721495A
JPS5721495A JP9489380A JP9489380A JPS5721495A JP S5721495 A JPS5721495 A JP S5721495A JP 9489380 A JP9489380 A JP 9489380A JP 9489380 A JP9489380 A JP 9489380A JP S5721495 A JPS5721495 A JP S5721495A
Authority
JP
Japan
Prior art keywords
polyethylene glycol
normal temp
liquid
solid
semisolid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9489380A
Other languages
Japanese (ja)
Inventor
Hiromichi Nakamura
Yasuo Tsujisato
Shigeru Mazaki
Ryozo Kikuma
Katsuhiko Takahashi
Shigeru Arai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Metal Corp
Original Assignee
Mitsubishi Metal Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Metal Corp filed Critical Mitsubishi Metal Corp
Priority to JP9489380A priority Critical patent/JPS5721495A/en
Publication of JPS5721495A publication Critical patent/JPS5721495A/en
Pending legal-status Critical Current

Links

Landscapes

  • Lubricants (AREA)

Abstract

PURPOSE: A cutting agent with lubricating and cooling properties, liquid at normal temp. and contg. polyethylene glycol, of which the waste is easily disposable.
CONSTITUTION: A cutting oil, liquid at normal temp. and contg. polyethylene glycol, e.g., a mixt. of polyethylene glycol and water. Although said polyethylene glycol is semisolid or solid at normal temp. depending on molecular wt., it is possible to use the both. In the case of polyethylene glycol which is semisolid on solid at normal temp., the waste liquid becomes semisolid or solid by vaporization of water, causing clogging of a pipeline. Therefore it is pref. to use a polyethylene glycol liquid at normal temp. It is also possible to adjust viscosity from about 0W500cst at 20°C by varying the content of the ethylene glycol or water, or using a polyethylene glycol different in molecular wt.
COPYRIGHT: (C)1982,JPO&Japio
JP9489380A 1980-07-11 1980-07-11 Cutting agent Pending JPS5721495A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9489380A JPS5721495A (en) 1980-07-11 1980-07-11 Cutting agent

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9489380A JPS5721495A (en) 1980-07-11 1980-07-11 Cutting agent

Publications (1)

Publication Number Publication Date
JPS5721495A true JPS5721495A (en) 1982-02-04

Family

ID=14122708

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9489380A Pending JPS5721495A (en) 1980-07-11 1980-07-11 Cutting agent

Country Status (1)

Country Link
JP (1) JPS5721495A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5349149A (en) * 1989-10-04 1994-09-20 Castrol Limited Burmah Castrol House Dual-purpose fluid for cutting and electrical discharge machining
EP0837115A1 (en) * 1996-10-17 1998-04-22 Wacker Siltronic Gesellschaft für Halbleitermaterialien Aktiengesellschaft Slicing slurry and method for cutting wafers from a crystal
CN107384568A (en) * 2017-06-17 2017-11-24 常州福隆工控设备有限公司 A kind of recoverying and utilizing method of silicon chip dicing waste mortar

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5349149A (en) * 1989-10-04 1994-09-20 Castrol Limited Burmah Castrol House Dual-purpose fluid for cutting and electrical discharge machining
EP0837115A1 (en) * 1996-10-17 1998-04-22 Wacker Siltronic Gesellschaft für Halbleitermaterialien Aktiengesellschaft Slicing slurry and method for cutting wafers from a crystal
US5947102A (en) * 1996-10-17 1999-09-07 Wacker Siltronic Gesellschaft Fur Halbleitermaterialien Ag Method for cutting wafers from a crystal
CN107384568A (en) * 2017-06-17 2017-11-24 常州福隆工控设备有限公司 A kind of recoverying and utilizing method of silicon chip dicing waste mortar

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