JPS57209911A - Production of polyethylene resin molding - Google Patents
Production of polyethylene resin moldingInfo
- Publication number
- JPS57209911A JPS57209911A JP9538081A JP9538081A JPS57209911A JP S57209911 A JPS57209911 A JP S57209911A JP 9538081 A JP9538081 A JP 9538081A JP 9538081 A JP9538081 A JP 9538081A JP S57209911 A JPS57209911 A JP S57209911A
- Authority
- JP
- Japan
- Prior art keywords
- polyethylene resin
- organic
- blend
- peroxide
- molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920013716 polyethylene resin Polymers 0.000 title abstract 5
- 238000000465 moulding Methods 0.000 title abstract 4
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000000203 mixture Substances 0.000 abstract 5
- 238000004132 cross linking Methods 0.000 abstract 4
- 150000001451 organic peroxides Chemical class 0.000 abstract 3
- 238000002156 mixing Methods 0.000 abstract 2
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 abstract 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 229920001577 copolymer Polymers 0.000 abstract 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 abstract 1
- -1 polyethylene, ethylene Polymers 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
Landscapes
- Graft Or Block Polymers (AREA)
Abstract
PURPOSE: To obtain, with good operability, a molding excellent in mechanical strength, etc., and suitable for wire coatings, etc., by blending a polyethylene resin containing an organic peroxide with a polyethylene resin containing an organic crosslinking aid and heat-molding the blend.
CONSTITUTION: The following two components A and B are prepared separately: (A) 99W20pts.wt. composition comprising 100pts.wt. polyethylene resin (e.g., polyethylene, ethylene/vinyl acetate copolymer) and 0.05W10pts.wt. organic peroxide (e.g., di-t-butyl peroxide, dicumyl peroxide) and (B) 1W80pts.wt. composition comprising 100pts.wt. polyethylene resin and 0.03W30pts.wt. organic crosslinking aid (e.g., methyl methacrylate, maleic anhydride). The titled molding is prepared by blending the components A and B and heating the blend thereby to form crosslinking bonds within the resin through the action of the organic peroxide and the organic crosslinking aid and, at the same time, to mold the blend.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9538081A JPS57209911A (en) | 1981-06-22 | 1981-06-22 | Production of polyethylene resin molding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9538081A JPS57209911A (en) | 1981-06-22 | 1981-06-22 | Production of polyethylene resin molding |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS57209911A true JPS57209911A (en) | 1982-12-23 |
Family
ID=14136035
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9538081A Pending JPS57209911A (en) | 1981-06-22 | 1981-06-22 | Production of polyethylene resin molding |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57209911A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59197414A (en) * | 1983-04-26 | 1984-11-09 | Mitsubishi Chem Ind Ltd | Production of blow-molded polyethylene article |
| US4933305A (en) * | 1987-07-31 | 1990-06-12 | Nec Corporation | Process of wire bonding for semiconductor device |
-
1981
- 1981-06-22 JP JP9538081A patent/JPS57209911A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59197414A (en) * | 1983-04-26 | 1984-11-09 | Mitsubishi Chem Ind Ltd | Production of blow-molded polyethylene article |
| US4933305A (en) * | 1987-07-31 | 1990-06-12 | Nec Corporation | Process of wire bonding for semiconductor device |
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