JPS57201861U - - Google Patents
Info
- Publication number
- JPS57201861U JPS57201861U JP8985381U JP8985381U JPS57201861U JP S57201861 U JPS57201861 U JP S57201861U JP 8985381 U JP8985381 U JP 8985381U JP 8985381 U JP8985381 U JP 8985381U JP S57201861 U JPS57201861 U JP S57201861U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8985381U JPS57201861U (ja) | 1981-06-17 | 1981-06-17 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8985381U JPS57201861U (ja) | 1981-06-17 | 1981-06-17 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57201861U true JPS57201861U (ja) | 1982-12-22 |
Family
ID=29884987
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8985381U Pending JPS57201861U (ja) | 1981-06-17 | 1981-06-17 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57201861U (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020059179A1 (ja) * | 2018-09-19 | 2020-03-26 | 日立オートモティブシステムズ株式会社 | 電子装置および電子装置における回路基板の絶縁材層形成方法 |
JP2021022715A (ja) * | 2019-07-30 | 2021-02-18 | パナソニックIpマネジメント株式会社 | 回路基板、電源装置及び照明器具 |
-
1981
- 1981-06-17 JP JP8985381U patent/JPS57201861U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020059179A1 (ja) * | 2018-09-19 | 2020-03-26 | 日立オートモティブシステムズ株式会社 | 電子装置および電子装置における回路基板の絶縁材層形成方法 |
JP2021022715A (ja) * | 2019-07-30 | 2021-02-18 | パナソニックIpマネジメント株式会社 | 回路基板、電源装置及び照明器具 |