JPS5719573B2 - - Google Patents
Info
- Publication number
- JPS5719573B2 JPS5719573B2 JP8472072A JP8472072A JPS5719573B2 JP S5719573 B2 JPS5719573 B2 JP S5719573B2 JP 8472072 A JP8472072 A JP 8472072A JP 8472072 A JP8472072 A JP 8472072A JP S5719573 B2 JPS5719573 B2 JP S5719573B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/27—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dicing (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8472072A JPS5719573B2 (ja) | 1972-08-23 | 1972-08-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8472072A JPS5719573B2 (ja) | 1972-08-23 | 1972-08-23 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4940670A JPS4940670A (ja) | 1974-04-16 |
| JPS5719573B2 true JPS5719573B2 (ja) | 1982-04-23 |
Family
ID=13838503
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8472072A Expired JPS5719573B2 (ja) | 1972-08-23 | 1972-08-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5719573B2 (ja) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE899260A (fr) * | 1984-03-27 | 1984-07-16 | Fmc Corp | Machine a fabriquer des sacs en matiere thermoplastique. |
| JP5312970B2 (ja) * | 2009-02-06 | 2013-10-09 | 株式会社ディスコ | 半導体ウエーハの分割方法 |
-
1972
- 1972-08-23 JP JP8472072A patent/JPS5719573B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4940670A (ja) | 1974-04-16 |