JPS5719571B2 - - Google Patents
Info
- Publication number
- JPS5719571B2 JPS5719571B2 JP14516079A JP14516079A JPS5719571B2 JP S5719571 B2 JPS5719571 B2 JP S5719571B2 JP 14516079 A JP14516079 A JP 14516079A JP 14516079 A JP14516079 A JP 14516079A JP S5719571 B2 JPS5719571 B2 JP S5719571B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Drying Of Semiconductors (AREA)
- Weting (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14516079A JPS5669833A (en) | 1979-11-09 | 1979-11-09 | Fine processing method of thin film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14516079A JPS5669833A (en) | 1979-11-09 | 1979-11-09 | Fine processing method of thin film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5669833A JPS5669833A (en) | 1981-06-11 |
| JPS5719571B2 true JPS5719571B2 (US20030204162A1-20031030-M00001.png) | 1982-04-23 |
Family
ID=15378807
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14516079A Granted JPS5669833A (en) | 1979-11-09 | 1979-11-09 | Fine processing method of thin film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5669833A (US20030204162A1-20031030-M00001.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6211241U (US20030204162A1-20031030-M00001.png) * | 1985-07-02 | 1987-01-23 |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5893343A (ja) * | 1981-11-30 | 1983-06-03 | Toshiba Corp | 半導体集積回路の分離領域形成方法 |
| JPS5952848A (ja) * | 1982-09-20 | 1984-03-27 | Mitsubishi Electric Corp | 半導体装置の製造方法 |
| JPS5978542A (ja) * | 1982-10-27 | 1984-05-07 | Nippon Telegr & Teleph Corp <Ntt> | 半導体装置の製造方法 |
-
1979
- 1979-11-09 JP JP14516079A patent/JPS5669833A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6211241U (US20030204162A1-20031030-M00001.png) * | 1985-07-02 | 1987-01-23 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5669833A (en) | 1981-06-11 |
