JPS57172745A - Manufacture of resin sealed type electronic parts - Google Patents
Manufacture of resin sealed type electronic partsInfo
- Publication number
- JPS57172745A JPS57172745A JP5174982A JP5174982A JPS57172745A JP S57172745 A JPS57172745 A JP S57172745A JP 5174982 A JP5174982 A JP 5174982A JP 5174982 A JP5174982 A JP 5174982A JP S57172745 A JPS57172745 A JP S57172745A
- Authority
- JP
- Japan
- Prior art keywords
- marks
- manufacture
- electronic parts
- type electronic
- coarse surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 title abstract 3
- 229920005989 resin Polymers 0.000 title abstract 3
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000007789 sealing Methods 0.000 abstract 4
- 239000002184 metal Substances 0.000 abstract 3
- 230000008034 disappearance Effects 0.000 abstract 2
- 238000000926 separation method Methods 0.000 abstract 2
- 238000005498 polishing Methods 0.000 abstract 1
- 239000000843 powder Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5174982A JPS57172745A (en) | 1982-03-29 | 1982-03-29 | Manufacture of resin sealed type electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5174982A JPS57172745A (en) | 1982-03-29 | 1982-03-29 | Manufacture of resin sealed type electronic parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS57172745A true JPS57172745A (en) | 1982-10-23 |
Family
ID=12895573
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5174982A Pending JPS57172745A (en) | 1982-03-29 | 1982-03-29 | Manufacture of resin sealed type electronic parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57172745A (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008030801A (ja) * | 2006-07-28 | 2008-02-14 | Key Tranding Co Ltd | キャップ付き容器 |
-
1982
- 1982-03-29 JP JP5174982A patent/JPS57172745A/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008030801A (ja) * | 2006-07-28 | 2008-02-14 | Key Tranding Co Ltd | キャップ付き容器 |
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