JPS5717142A - Non-contact measuring method for semiconductor wafer - Google Patents

Non-contact measuring method for semiconductor wafer

Info

Publication number
JPS5717142A
JPS5717142A JP9067180A JP9067180A JPS5717142A JP S5717142 A JPS5717142 A JP S5717142A JP 9067180 A JP9067180 A JP 9067180A JP 9067180 A JP9067180 A JP 9067180A JP S5717142 A JPS5717142 A JP S5717142A
Authority
JP
Japan
Prior art keywords
wafer
semiconductor wafer
change
resonance
resonance waveform
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9067180A
Other languages
Japanese (ja)
Inventor
Akira Usami
Nobue Inage
Yoshinobu Fujiwara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SPC Electronics Corp
Shimada Rika Kogyo KK
Original Assignee
SPC Electronics Corp
Shimada Rika Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SPC Electronics Corp, Shimada Rika Kogyo KK filed Critical SPC Electronics Corp
Priority to JP9067180A priority Critical patent/JPS5717142A/en
Publication of JPS5717142A publication Critical patent/JPS5717142A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PURPOSE:To measure the resistivity and the lifetime of a wafer by a method wherein the non-contact detecting element in a loop circuit is placed under a resonating condition and moved close to the semiconductor wafer to be measured and a measurement is performed by the reflected output obtained from the loop circuit. CONSTITUTION:High-frequency power is supplied to a loop 4, the yttrium-iron- garnet (called YIG ball hereinafter) 3 generated resonance of electron spin in a YIG ball 3 by controlling the relating positions of magnets 5 and the center frequency, the bandwidth and the amplitude of a resonance waveform makes a change when the semiconductor wafer W is moved close to the YIG ball 3. Therefore, a relative measurement of a resistivity can be performed based on the change of the resonance waveform generated by the wafer W on a retaining plate 8, and also, by having a constant frequency, the life time of the wafer can be measured from said change of the resonance waveform by performing an ion implantation by irradiating infrared rays on the upper part of the wafer.
JP9067180A 1980-07-04 1980-07-04 Non-contact measuring method for semiconductor wafer Pending JPS5717142A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9067180A JPS5717142A (en) 1980-07-04 1980-07-04 Non-contact measuring method for semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9067180A JPS5717142A (en) 1980-07-04 1980-07-04 Non-contact measuring method for semiconductor wafer

Publications (1)

Publication Number Publication Date
JPS5717142A true JPS5717142A (en) 1982-01-28

Family

ID=14004994

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9067180A Pending JPS5717142A (en) 1980-07-04 1980-07-04 Non-contact measuring method for semiconductor wafer

Country Status (1)

Country Link
JP (1) JPS5717142A (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5249308A (en) * 1975-10-15 1977-04-20 Rei Tech Inc Preventing method of peeling between layers
JPS538472A (en) * 1976-07-10 1978-01-25 Girling Ltd Disk brake

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5249308A (en) * 1975-10-15 1977-04-20 Rei Tech Inc Preventing method of peeling between layers
JPS538472A (en) * 1976-07-10 1978-01-25 Girling Ltd Disk brake

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