JPS57166399U - - Google Patents
Info
- Publication number
- JPS57166399U JPS57166399U JP5373981U JP5373981U JPS57166399U JP S57166399 U JPS57166399 U JP S57166399U JP 5373981 U JP5373981 U JP 5373981U JP 5373981 U JP5373981 U JP 5373981U JP S57166399 U JPS57166399 U JP S57166399U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5373981U JPS57166399U (enExample) | 1981-04-13 | 1981-04-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5373981U JPS57166399U (enExample) | 1981-04-13 | 1981-04-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS57166399U true JPS57166399U (enExample) | 1982-10-20 |
Family
ID=29850361
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5373981U Pending JPS57166399U (enExample) | 1981-04-13 | 1981-04-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57166399U (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6194730A (ja) * | 1984-10-17 | 1986-05-13 | Shigeru Tsutsumi | 小型精密射出成形装置 |
| JPS63240035A (ja) * | 1987-03-27 | 1988-10-05 | Matsushita Electric Works Ltd | 電子部品封止成形装置 |
-
1981
- 1981-04-13 JP JP5373981U patent/JPS57166399U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6194730A (ja) * | 1984-10-17 | 1986-05-13 | Shigeru Tsutsumi | 小型精密射出成形装置 |
| JPS63240035A (ja) * | 1987-03-27 | 1988-10-05 | Matsushita Electric Works Ltd | 電子部品封止成形装置 |