JPS57165477A - Bonding method - Google Patents
Bonding methodInfo
- Publication number
- JPS57165477A JPS57165477A JP56050998A JP5099881A JPS57165477A JP S57165477 A JPS57165477 A JP S57165477A JP 56050998 A JP56050998 A JP 56050998A JP 5099881 A JP5099881 A JP 5099881A JP S57165477 A JPS57165477 A JP S57165477A
- Authority
- JP
- Japan
- Prior art keywords
- film
- fluoroplastic
- powder
- bonding
- melt adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Polyurethanes Or Polyureas (AREA)
Abstract
PURPOSE: To bond a fluoroplastic film, etc. to the other adhered, easily and firmly, by applying a primer composition composed of a specific polyester resin, fluoroplastic powder, etc. to the surface of the fluoroplastic film, and bonding with a specific hot-melt adhesive.
CONSTITUTION: The surface of a fluoroplastic film, molded article or coating film, is coated with a primer composition compsosed of (A) 5W60wt% polyester resin and/or polyurethane resin having a reduced viscosity of 0.3W2.0, a glass transition temperature of 45W100°C and a softening point of 80W200°C, (B) 0.05W 20% fluoroplastic powder (e.g. polyethylene fluoride powder) or fluorocarbon powder having a particle diameter of 0.01W10μ, and (C) 94.9W30% water and/or organic compound having a boiling point of 50W180°C (e.g. methanol), and the other adherend is bonded to the coated surface using a hot-melt adhesive having a melting point of 80W180°C.
USE: Suitable for the bonding of a polyvinyl fluoride film to a metal sheet or a plastic film.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56050998A JPS57165477A (en) | 1981-04-03 | 1981-04-03 | Bonding method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56050998A JPS57165477A (en) | 1981-04-03 | 1981-04-03 | Bonding method |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57165477A true JPS57165477A (en) | 1982-10-12 |
Family
ID=12874451
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP56050998A Pending JPS57165477A (en) | 1981-04-03 | 1981-04-03 | Bonding method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57165477A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03166944A (en) * | 1989-11-27 | 1991-07-18 | Tootsuya:Kk | Hot melt type in-line sheet lamination apparatus |
JPH03291557A (en) * | 1989-12-26 | 1991-12-20 | Fuji Photo Film Co Ltd | Ion selective electrode and ion activity measuring element using this electrode |
-
1981
- 1981-04-03 JP JP56050998A patent/JPS57165477A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03166944A (en) * | 1989-11-27 | 1991-07-18 | Tootsuya:Kk | Hot melt type in-line sheet lamination apparatus |
JPH03291557A (en) * | 1989-12-26 | 1991-12-20 | Fuji Photo Film Co Ltd | Ion selective electrode and ion activity measuring element using this electrode |
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