JPS5716492B2 - - Google Patents
Info
- Publication number
- JPS5716492B2 JPS5716492B2 JP7877073A JP7877073A JPS5716492B2 JP S5716492 B2 JPS5716492 B2 JP S5716492B2 JP 7877073 A JP7877073 A JP 7877073A JP 7877073 A JP7877073 A JP 7877073A JP S5716492 B2 JPS5716492 B2 JP S5716492B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7877073A JPS5716492B2 (ja) | 1973-07-11 | 1973-07-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7877073A JPS5716492B2 (ja) | 1973-07-11 | 1973-07-11 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5028272A JPS5028272A (ja) | 1975-03-22 |
| JPS5716492B2 true JPS5716492B2 (ja) | 1982-04-05 |
Family
ID=13671127
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7877073A Expired JPS5716492B2 (ja) | 1973-07-11 | 1973-07-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5716492B2 (ja) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5820930Y2 (ja) * | 1977-09-30 | 1983-05-02 | 株式会社島津製作所 | 恒温槽温度制御装置 |
| JPS5715447A (en) * | 1980-06-30 | 1982-01-26 | Sharp Corp | Production of substrate for carrying components |
| JPS6030539U (ja) * | 1983-08-09 | 1985-03-01 | 富士電機株式会社 | 半導体装置 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4834672A (ja) * | 1971-09-07 | 1973-05-21 |
-
1973
- 1973-07-11 JP JP7877073A patent/JPS5716492B2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4834672A (ja) * | 1971-09-07 | 1973-05-21 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5028272A (ja) | 1975-03-22 |