JPS57159277U - - Google Patents
Info
- Publication number
- JPS57159277U JPS57159277U JP1981045848U JP4584881U JPS57159277U JP S57159277 U JPS57159277 U JP S57159277U JP 1981045848 U JP1981045848 U JP 1981045848U JP 4584881 U JP4584881 U JP 4584881U JP S57159277 U JPS57159277 U JP S57159277U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981045848U JPS57159277U (ja) | 1981-03-31 | 1981-03-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981045848U JPS57159277U (ja) | 1981-03-31 | 1981-03-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS57159277U true JPS57159277U (ja) | 1982-10-06 |
Family
ID=29842723
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1981045848U Pending JPS57159277U (ja) | 1981-03-31 | 1981-03-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57159277U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001085826A (ja) * | 1999-09-14 | 2001-03-30 | Mitsubishi Electric Corp | 配線基板 |
-
1981
- 1981-03-31 JP JP1981045848U patent/JPS57159277U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001085826A (ja) * | 1999-09-14 | 2001-03-30 | Mitsubishi Electric Corp | 配線基板 |