JPS5715915A - Molding method for resin - Google Patents
Molding method for resinInfo
- Publication number
- JPS5715915A JPS5715915A JP9043480A JP9043480A JPS5715915A JP S5715915 A JPS5715915 A JP S5715915A JP 9043480 A JP9043480 A JP 9043480A JP 9043480 A JP9043480 A JP 9043480A JP S5715915 A JPS5715915 A JP S5715915A
- Authority
- JP
- Japan
- Prior art keywords
- cavity
- resin material
- injected
- molded
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/16—Making multilayered or multicoloured articles
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Molding Of Porous Articles (AREA)
Abstract
PURPOSE:To obtain a shape, the adhesive property of both the first resin material and the second resin material thereof is excellent, by a method wherein the first resin material is injected into a cavity, into which a pad is charged and molded, the pad is removed and the second resin material is injected and molded. CONSTITUTION:The pad 16 in silicon rubber is charged into the first cavity 15 of the cavity 10 of a molding die 8, a core 9 is combined and the second cavity 17 is formed, and the first resin material is injected into the cavity 17 through a liquid injecting port 14 from a mixing head 4 and molded. The die 8 is opened, the pad 16 is mold-released from the cavity 15, the die 8 is clamped, and the second resin material is injected into the cavity 15 through the injecting port 14 from a mixing head 5 and molded while the both resin materials are bonded integrally.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9043480A JPS5715915A (en) | 1980-07-02 | 1980-07-02 | Molding method for resin |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9043480A JPS5715915A (en) | 1980-07-02 | 1980-07-02 | Molding method for resin |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5715915A true JPS5715915A (en) | 1982-01-27 |
JPH0117847B2 JPH0117847B2 (en) | 1989-04-03 |
Family
ID=13998495
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9043480A Granted JPS5715915A (en) | 1980-07-02 | 1980-07-02 | Molding method for resin |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5715915A (en) |
-
1980
- 1980-07-02 JP JP9043480A patent/JPS5715915A/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPH0117847B2 (en) | 1989-04-03 |
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