JPS57154162U - - Google Patents

Info

Publication number
JPS57154162U
JPS57154162U JP4044881U JP4044881U JPS57154162U JP S57154162 U JPS57154162 U JP S57154162U JP 4044881 U JP4044881 U JP 4044881U JP 4044881 U JP4044881 U JP 4044881U JP S57154162 U JPS57154162 U JP S57154162U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4044881U
Other languages
Japanese (ja)
Other versions
JPS635247Y2 (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1981040448U priority Critical patent/JPS635247Y2/ja
Publication of JPS57154162U publication Critical patent/JPS57154162U/ja
Application granted granted Critical
Publication of JPS635247Y2 publication Critical patent/JPS635247Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
JP1981040448U 1981-03-23 1981-03-23 Expired JPS635247Y2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981040448U JPS635247Y2 (enrdf_load_stackoverflow) 1981-03-23 1981-03-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981040448U JPS635247Y2 (enrdf_load_stackoverflow) 1981-03-23 1981-03-23

Publications (2)

Publication Number Publication Date
JPS57154162U true JPS57154162U (enrdf_load_stackoverflow) 1982-09-28
JPS635247Y2 JPS635247Y2 (enrdf_load_stackoverflow) 1988-02-12

Family

ID=29837562

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981040448U Expired JPS635247Y2 (enrdf_load_stackoverflow) 1981-03-23 1981-03-23

Country Status (1)

Country Link
JP (1) JPS635247Y2 (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006303086A (ja) * 2005-04-19 2006-11-02 Toyota Industries Corp 半導体装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5543105A (en) * 1978-09-20 1980-03-26 Hitachi Ltd Refrigerant sealing liquid
JPS5653090A (en) * 1979-10-08 1981-05-12 Dainippon Printing Co Ltd Method of setting heat-sensitive record and device thereof

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5543105A (en) * 1978-09-20 1980-03-26 Hitachi Ltd Refrigerant sealing liquid
JPS5653090A (en) * 1979-10-08 1981-05-12 Dainippon Printing Co Ltd Method of setting heat-sensitive record and device thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006303086A (ja) * 2005-04-19 2006-11-02 Toyota Industries Corp 半導体装置

Also Published As

Publication number Publication date
JPS635247Y2 (enrdf_load_stackoverflow) 1988-02-12

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