JPS57154162U - - Google Patents
Info
- Publication number
- JPS57154162U JPS57154162U JP1981040448U JP4044881U JPS57154162U JP S57154162 U JPS57154162 U JP S57154162U JP 1981040448 U JP1981040448 U JP 1981040448U JP 4044881 U JP4044881 U JP 4044881U JP S57154162 U JPS57154162 U JP S57154162U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981040448U JPS635247Y2 (cg-RX-API-DMAC7.html) | 1981-03-23 | 1981-03-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981040448U JPS635247Y2 (cg-RX-API-DMAC7.html) | 1981-03-23 | 1981-03-23 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57154162U true JPS57154162U (cg-RX-API-DMAC7.html) | 1982-09-28 |
| JPS635247Y2 JPS635247Y2 (cg-RX-API-DMAC7.html) | 1988-02-12 |
Family
ID=29837562
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1981040448U Expired JPS635247Y2 (cg-RX-API-DMAC7.html) | 1981-03-23 | 1981-03-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS635247Y2 (cg-RX-API-DMAC7.html) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006303086A (ja) * | 2005-04-19 | 2006-11-02 | Toyota Industries Corp | 半導体装置 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5543105A (en) * | 1978-09-20 | 1980-03-26 | Hitachi Ltd | Refrigerant sealing liquid |
| JPS5653090A (en) * | 1979-10-08 | 1981-05-12 | Dainippon Printing Co Ltd | Method of setting heat-sensitive record and device thereof |
-
1981
- 1981-03-23 JP JP1981040448U patent/JPS635247Y2/ja not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5543105A (en) * | 1978-09-20 | 1980-03-26 | Hitachi Ltd | Refrigerant sealing liquid |
| JPS5653090A (en) * | 1979-10-08 | 1981-05-12 | Dainippon Printing Co Ltd | Method of setting heat-sensitive record and device thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006303086A (ja) * | 2005-04-19 | 2006-11-02 | Toyota Industries Corp | 半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS635247Y2 (cg-RX-API-DMAC7.html) | 1988-02-12 |