JPS57154162U - - Google Patents

Info

Publication number
JPS57154162U
JPS57154162U JP1981040448U JP4044881U JPS57154162U JP S57154162 U JPS57154162 U JP S57154162U JP 1981040448 U JP1981040448 U JP 1981040448U JP 4044881 U JP4044881 U JP 4044881U JP S57154162 U JPS57154162 U JP S57154162U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1981040448U
Other languages
Japanese (ja)
Other versions
JPS635247Y2 (cg-RX-API-DMAC7.html
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1981040448U priority Critical patent/JPS635247Y2/ja
Publication of JPS57154162U publication Critical patent/JPS57154162U/ja
Application granted granted Critical
Publication of JPS635247Y2 publication Critical patent/JPS635247Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
JP1981040448U 1981-03-23 1981-03-23 Expired JPS635247Y2 (cg-RX-API-DMAC7.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981040448U JPS635247Y2 (cg-RX-API-DMAC7.html) 1981-03-23 1981-03-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981040448U JPS635247Y2 (cg-RX-API-DMAC7.html) 1981-03-23 1981-03-23

Publications (2)

Publication Number Publication Date
JPS57154162U true JPS57154162U (cg-RX-API-DMAC7.html) 1982-09-28
JPS635247Y2 JPS635247Y2 (cg-RX-API-DMAC7.html) 1988-02-12

Family

ID=29837562

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981040448U Expired JPS635247Y2 (cg-RX-API-DMAC7.html) 1981-03-23 1981-03-23

Country Status (1)

Country Link
JP (1) JPS635247Y2 (cg-RX-API-DMAC7.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006303086A (ja) * 2005-04-19 2006-11-02 Toyota Industries Corp 半導体装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5543105A (en) * 1978-09-20 1980-03-26 Hitachi Ltd Refrigerant sealing liquid
JPS5653090A (en) * 1979-10-08 1981-05-12 Dainippon Printing Co Ltd Method of setting heat-sensitive record and device thereof

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5543105A (en) * 1978-09-20 1980-03-26 Hitachi Ltd Refrigerant sealing liquid
JPS5653090A (en) * 1979-10-08 1981-05-12 Dainippon Printing Co Ltd Method of setting heat-sensitive record and device thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006303086A (ja) * 2005-04-19 2006-11-02 Toyota Industries Corp 半導体装置

Also Published As

Publication number Publication date
JPS635247Y2 (cg-RX-API-DMAC7.html) 1988-02-12

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