JPS57154162U - - Google Patents

Info

Publication number
JPS57154162U
JPS57154162U JP4044881U JP4044881U JPS57154162U JP S57154162 U JPS57154162 U JP S57154162U JP 4044881 U JP4044881 U JP 4044881U JP 4044881 U JP4044881 U JP 4044881U JP S57154162 U JPS57154162 U JP S57154162U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4044881U
Other languages
Japanese (ja)
Other versions
JPS635247Y2 (OSRAM
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1981040448U priority Critical patent/JPS635247Y2/ja
Publication of JPS57154162U publication Critical patent/JPS57154162U/ja
Application granted granted Critical
Publication of JPS635247Y2 publication Critical patent/JPS635247Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/4847Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73265Layer and wire connectors
JP1981040448U 1981-03-23 1981-03-23 Expired JPS635247Y2 (OSRAM)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981040448U JPS635247Y2 (OSRAM) 1981-03-23 1981-03-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981040448U JPS635247Y2 (OSRAM) 1981-03-23 1981-03-23

Publications (2)

Publication Number Publication Date
JPS57154162U true JPS57154162U (OSRAM) 1982-09-28
JPS635247Y2 JPS635247Y2 (OSRAM) 1988-02-12

Family

ID=29837562

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981040448U Expired JPS635247Y2 (OSRAM) 1981-03-23 1981-03-23

Country Status (1)

Country Link
JP (1) JPS635247Y2 (OSRAM)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006303086A (ja) * 2005-04-19 2006-11-02 Toyota Industries Corp 半導体装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5543105A (en) * 1978-09-20 1980-03-26 Hitachi Ltd Refrigerant sealing liquid
JPS5653090A (en) * 1979-10-08 1981-05-12 Dainippon Printing Co Ltd Method of setting heat-sensitive record and device thereof

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5543105A (en) * 1978-09-20 1980-03-26 Hitachi Ltd Refrigerant sealing liquid
JPS5653090A (en) * 1979-10-08 1981-05-12 Dainippon Printing Co Ltd Method of setting heat-sensitive record and device thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006303086A (ja) * 2005-04-19 2006-11-02 Toyota Industries Corp 半導体装置

Also Published As

Publication number Publication date
JPS635247Y2 (OSRAM) 1988-02-12

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