JPS57154162U - - Google Patents

Info

Publication number
JPS57154162U
JPS57154162U JP4044881U JP4044881U JPS57154162U JP S57154162 U JPS57154162 U JP S57154162U JP 4044881 U JP4044881 U JP 4044881U JP 4044881 U JP4044881 U JP 4044881U JP S57154162 U JPS57154162 U JP S57154162U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4044881U
Other languages
Japanese (ja)
Other versions
JPS635247Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1981040448U priority Critical patent/JPS635247Y2/ja
Publication of JPS57154162U publication Critical patent/JPS57154162U/ja
Application granted granted Critical
Publication of JPS635247Y2 publication Critical patent/JPS635247Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/4847Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73265Layer and wire connectors
JP1981040448U 1981-03-23 1981-03-23 Expired JPS635247Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981040448U JPS635247Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1981-03-23 1981-03-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981040448U JPS635247Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1981-03-23 1981-03-23

Publications (2)

Publication Number Publication Date
JPS57154162U true JPS57154162U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1982-09-28
JPS635247Y2 JPS635247Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1988-02-12

Family

ID=29837562

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981040448U Expired JPS635247Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1981-03-23 1981-03-23

Country Status (1)

Country Link
JP (1) JPS635247Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006303086A (ja) * 2005-04-19 2006-11-02 Toyota Industries Corp 半導体装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5543105A (en) * 1978-09-20 1980-03-26 Hitachi Ltd Refrigerant sealing liquid
JPS5653090A (en) * 1979-10-08 1981-05-12 Dainippon Printing Co Ltd Method of setting heat-sensitive record and device thereof

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5543105A (en) * 1978-09-20 1980-03-26 Hitachi Ltd Refrigerant sealing liquid
JPS5653090A (en) * 1979-10-08 1981-05-12 Dainippon Printing Co Ltd Method of setting heat-sensitive record and device thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006303086A (ja) * 2005-04-19 2006-11-02 Toyota Industries Corp 半導体装置

Also Published As

Publication number Publication date
JPS635247Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1988-02-12

Similar Documents

Publication Publication Date Title
FR2503896B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
FR2501779B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
FR2499010B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
FR2502887B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
FR2502230B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
FR2502155B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPS57193607U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
FR2503202B3 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
FR2503494B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
FR2501736B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
FR2504037B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
FR2502065B3 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPS57197415U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
FR2501915B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
FR2501876B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
FR2503440B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
FR2502236B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPS611185Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
FR2501866B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
FR2501637B3 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
FR2503181B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPS57170751U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
FR2501877B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
FR2503338B3 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
FR2503180B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)