JPS57153046A - Curable resin composition - Google Patents
Curable resin compositionInfo
- Publication number
- JPS57153046A JPS57153046A JP3983281A JP3983281A JPS57153046A JP S57153046 A JPS57153046 A JP S57153046A JP 3983281 A JP3983281 A JP 3983281A JP 3983281 A JP3983281 A JP 3983281A JP S57153046 A JPS57153046 A JP S57153046A
- Authority
- JP
- Japan
- Prior art keywords
- acrylonitrile copolymer
- contg
- ester resin
- cyanate ester
- modified butadiene
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
Abstract
PURPOSE: To provide the titled compsn. contg. a cyanate ester resin having improved flexing characteristics and adhesion, by adding a (meth)acryloyl group- modified butadiene/acrylonitrile copolymer to a cyanate ester resin compsn.
CONSTITUTION: A cyanate ester resin compsn. is mixed or pre-reacted with a modified butadiene/acrylonitrile copolymer contg. an introduced acryloyl and/or methacryloyl group on its side chain and/or its terminal. Said modified butadiene /acrylonitrile copolymer can be produced by reacting a butadiene/acrylonitrile copolymer having a number-average MW of 500W6,000 and contg. a hydroxyl or carboxyl group on its side chain and/or its terminal, with a compd. of the formula wherein R3 is H, methyl; Y is halogen, H; l is 1W3.
USE: Laminates, cast articles, adhesives, paint, etc.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3983281A JPS57153046A (en) | 1981-03-19 | 1981-03-19 | Curable resin composition |
| US06/260,982 US4403073A (en) | 1980-05-06 | 1981-05-06 | Curable resin composition |
| DE3117903A DE3117903C2 (en) | 1980-05-06 | 1981-05-06 | Curable resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3983281A JPS57153046A (en) | 1981-03-19 | 1981-03-19 | Curable resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57153046A true JPS57153046A (en) | 1982-09-21 |
| JPH0160064B2 JPH0160064B2 (en) | 1989-12-20 |
Family
ID=12563937
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3983281A Granted JPS57153046A (en) | 1980-05-06 | 1981-03-19 | Curable resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57153046A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018139368A1 (en) * | 2017-01-26 | 2018-08-02 | 三菱瓦斯化学株式会社 | Resin composition, prepreg, metal foil-clad laminated sheet, resin sheet, and printed wiring board |
| KR20180129764A (en) | 2016-04-01 | 2018-12-05 | 닛뽄 가야쿠 가부시키가이샤 | A thermosetting resin composition, a prepreg, and a cured product thereof |
| KR20190035731A (en) | 2016-08-05 | 2019-04-03 | 닛뽄 가야쿠 가부시키가이샤 | Maleimide resin composition, prepreg, cured product thereof, and semiconductor device |
| KR20190137106A (en) | 2017-04-28 | 2019-12-10 | 닛뽄 가야쿠 가부시키가이샤 | Maleimide resin composition, prepreg and cured product thereof |
| WO2024075480A1 (en) * | 2022-10-04 | 2024-04-11 | 三菱瓦斯化学株式会社 | Thermosetting resin composition, cured product of same, prepreg, fiber-reinforced composite material, and high-pressure gas container |
-
1981
- 1981-03-19 JP JP3983281A patent/JPS57153046A/en active Granted
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20180129764A (en) | 2016-04-01 | 2018-12-05 | 닛뽄 가야쿠 가부시키가이샤 | A thermosetting resin composition, a prepreg, and a cured product thereof |
| KR20190035731A (en) | 2016-08-05 | 2019-04-03 | 닛뽄 가야쿠 가부시키가이샤 | Maleimide resin composition, prepreg, cured product thereof, and semiconductor device |
| WO2018139368A1 (en) * | 2017-01-26 | 2018-08-02 | 三菱瓦斯化学株式会社 | Resin composition, prepreg, metal foil-clad laminated sheet, resin sheet, and printed wiring board |
| JPWO2018139368A1 (en) * | 2017-01-26 | 2019-02-07 | 三菱瓦斯化学株式会社 | Resin composition, prepreg, metal foil-clad laminate, resin sheet and printed wiring board |
| US11166370B2 (en) | 2017-01-26 | 2021-11-02 | Mitsubishi Gas Chemical Company, Inc. | Resin composition, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board |
| KR20190137106A (en) | 2017-04-28 | 2019-12-10 | 닛뽄 가야쿠 가부시키가이샤 | Maleimide resin composition, prepreg and cured product thereof |
| WO2024075480A1 (en) * | 2022-10-04 | 2024-04-11 | 三菱瓦斯化学株式会社 | Thermosetting resin composition, cured product of same, prepreg, fiber-reinforced composite material, and high-pressure gas container |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0160064B2 (en) | 1989-12-20 |
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