JPS57152944A - Manufacture of dry type molded board - Google Patents
Manufacture of dry type molded boardInfo
- Publication number
- JPS57152944A JPS57152944A JP56037914A JP3791481A JPS57152944A JP S57152944 A JPS57152944 A JP S57152944A JP 56037914 A JP56037914 A JP 56037914A JP 3791481 A JP3791481 A JP 3791481A JP S57152944 A JPS57152944 A JP S57152944A
- Authority
- JP
- Japan
- Prior art keywords
- manufacture
- dry type
- type molded
- molded board
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Dry Formation Of Fiberboard And The Like (AREA)
- Laminated Bodies (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56037914A JPS57152944A (en) | 1981-03-18 | 1981-03-18 | Manufacture of dry type molded board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56037914A JPS57152944A (en) | 1981-03-18 | 1981-03-18 | Manufacture of dry type molded board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57152944A true JPS57152944A (en) | 1982-09-21 |
| JPS6124183B2 JPS6124183B2 (cg-RX-API-DMAC10.html) | 1986-06-10 |
Family
ID=12510808
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56037914A Granted JPS57152944A (en) | 1981-03-18 | 1981-03-18 | Manufacture of dry type molded board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57152944A (cg-RX-API-DMAC10.html) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03281202A (ja) * | 1990-03-30 | 1991-12-11 | Mitsui Toatsu Chem Inc | パーティクルボードの製造方法 |
| WO2008026058A3 (en) * | 2006-08-31 | 2008-09-04 | Dynea Oy | Adhesive system and wood based panels comprising the adhesive system with low subsequent formaldehyde emission and suitable production procedure |
| WO2015001702A1 (ja) * | 2013-07-05 | 2015-01-08 | パナソニックIpマネジメント株式会社 | 木質板の製造方法及び木質板 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100548513B1 (ko) * | 2002-10-31 | 2006-02-02 | 매그나칩 반도체 유한회사 | 에스티아이 공정을 개선하기 위한 리버스 에치백 방법 |
-
1981
- 1981-03-18 JP JP56037914A patent/JPS57152944A/ja active Granted
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03281202A (ja) * | 1990-03-30 | 1991-12-11 | Mitsui Toatsu Chem Inc | パーティクルボードの製造方法 |
| WO2008026058A3 (en) * | 2006-08-31 | 2008-09-04 | Dynea Oy | Adhesive system and wood based panels comprising the adhesive system with low subsequent formaldehyde emission and suitable production procedure |
| WO2015001702A1 (ja) * | 2013-07-05 | 2015-01-08 | パナソニックIpマネジメント株式会社 | 木質板の製造方法及び木質板 |
| JP2015013442A (ja) * | 2013-07-05 | 2015-01-22 | パナソニックIpマネジメント株式会社 | 木質板の製造方法及び木質板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6124183B2 (cg-RX-API-DMAC10.html) | 1986-06-10 |
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