JPS57146360U - - Google Patents
Info
- Publication number
- JPS57146360U JPS57146360U JP3160481U JP3160481U JPS57146360U JP S57146360 U JPS57146360 U JP S57146360U JP 3160481 U JP3160481 U JP 3160481U JP 3160481 U JP3160481 U JP 3160481U JP S57146360 U JPS57146360 U JP S57146360U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3160481U JPS57146360U (en) | 1981-03-09 | 1981-03-09 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3160481U JPS57146360U (en) | 1981-03-09 | 1981-03-09 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57146360U true JPS57146360U (en) | 1982-09-14 |
Family
ID=29829031
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3160481U Pending JPS57146360U (en) | 1981-03-09 | 1981-03-09 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57146360U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007005839A (en) * | 2006-10-13 | 2007-01-11 | Mitsubishi Electric Corp | Surface mounting package and semiconductor device |
-
1981
- 1981-03-09 JP JP3160481U patent/JPS57146360U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007005839A (en) * | 2006-10-13 | 2007-01-11 | Mitsubishi Electric Corp | Surface mounting package and semiconductor device |
JP4563980B2 (en) * | 2006-10-13 | 2010-10-20 | 三菱電機株式会社 | Surface mount type package and semiconductor device |