JPS57141994A - Method of mounting ultrafine part on printed board - Google Patents
Method of mounting ultrafine part on printed boardInfo
- Publication number
- JPS57141994A JPS57141994A JP14450781A JP14450781A JPS57141994A JP S57141994 A JPS57141994 A JP S57141994A JP 14450781 A JP14450781 A JP 14450781A JP 14450781 A JP14450781 A JP 14450781A JP S57141994 A JPS57141994 A JP S57141994A
- Authority
- JP
- Japan
- Prior art keywords
- mounting
- printed board
- ultrafine
- ultrafine part
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14450781A JPS57141994A (en) | 1981-09-11 | 1981-09-11 | Method of mounting ultrafine part on printed board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14450781A JPS57141994A (en) | 1981-09-11 | 1981-09-11 | Method of mounting ultrafine part on printed board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57141994A true JPS57141994A (en) | 1982-09-02 |
Family
ID=15363963
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14450781A Pending JPS57141994A (en) | 1981-09-11 | 1981-09-11 | Method of mounting ultrafine part on printed board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57141994A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH036278A (en) * | 1989-06-02 | 1991-01-11 | Nitto Denko Corp | Adhesive for bonding electronic parts |
JPH03292796A (en) * | 1990-04-11 | 1991-12-24 | Nippon Steel Corp | Manufacture of copper plated laminar board for printed wiring board |
-
1981
- 1981-09-11 JP JP14450781A patent/JPS57141994A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH036278A (en) * | 1989-06-02 | 1991-01-11 | Nitto Denko Corp | Adhesive for bonding electronic parts |
JPH03292796A (en) * | 1990-04-11 | 1991-12-24 | Nippon Steel Corp | Manufacture of copper plated laminar board for printed wiring board |
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