JPS5713802Y2 - - Google Patents
Info
- Publication number
- JPS5713802Y2 JPS5713802Y2 JP1978147283U JP14728378U JPS5713802Y2 JP S5713802 Y2 JPS5713802 Y2 JP S5713802Y2 JP 1978147283 U JP1978147283 U JP 1978147283U JP 14728378 U JP14728378 U JP 14728378U JP S5713802 Y2 JPS5713802 Y2 JP S5713802Y2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1978147283U JPS5713802Y2 (cs) | 1978-10-25 | 1978-10-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1978147283U JPS5713802Y2 (cs) | 1978-10-25 | 1978-10-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5563161U JPS5563161U (cs) | 1980-04-30 |
| JPS5713802Y2 true JPS5713802Y2 (cs) | 1982-03-19 |
Family
ID=29128597
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1978147283U Expired JPS5713802Y2 (cs) | 1978-10-25 | 1978-10-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5713802Y2 (cs) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002280860A (ja) * | 2001-03-15 | 2002-09-27 | Densei Lambda Kk | ノイズフィルタ |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63211638A (ja) * | 1988-01-08 | 1988-09-02 | Nec Home Electronics Ltd | 樹脂封止型半導体装置の製造方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4867658U (cs) * | 1971-12-04 | 1973-08-28 |
-
1978
- 1978-10-25 JP JP1978147283U patent/JPS5713802Y2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002280860A (ja) * | 2001-03-15 | 2002-09-27 | Densei Lambda Kk | ノイズフィルタ |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5563161U (cs) | 1980-04-30 |