JPS57134998A - Multilayer array conductor and method of producing same - Google Patents

Multilayer array conductor and method of producing same

Info

Publication number
JPS57134998A
JPS57134998A JP57000020A JP2082A JPS57134998A JP S57134998 A JPS57134998 A JP S57134998A JP 57000020 A JP57000020 A JP 57000020A JP 2082 A JP2082 A JP 2082A JP S57134998 A JPS57134998 A JP S57134998A
Authority
JP
Japan
Prior art keywords
producing same
multilayer array
array conductor
conductor
multilayer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP57000020A
Other languages
English (en)
Inventor
Uiriamu Aichierubaa Chiyaarusu
Jiyon Uojinarousuki Robaato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of JPS57134998A publication Critical patent/JPS57134998A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
JP57000020A 1980-12-29 1982-01-04 Multilayer array conductor and method of producing same Pending JPS57134998A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/220,341 US4416914A (en) 1980-12-29 1980-12-29 Electrical conductors arranged in multiple layers and preparation thereof

Publications (1)

Publication Number Publication Date
JPS57134998A true JPS57134998A (en) 1982-08-20

Family

ID=22823170

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57000020A Pending JPS57134998A (en) 1980-12-29 1982-01-04 Multilayer array conductor and method of producing same

Country Status (5)

Country Link
US (1) US4416914A (ja)
JP (1) JPS57134998A (ja)
DE (1) DE3151262A1 (ja)
GB (1) GB2090476B (ja)
MX (1) MX151202A (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4812886A (en) * 1987-02-09 1989-03-14 International Business Machines Corporation Multilayer contact apparatus and method
JP2008062677A (ja) * 2006-09-04 2008-03-21 Ihi Marine United Inc 浮体の横揺れ低減構造
US7677838B2 (en) 2000-05-16 2010-03-16 Mitsubishi Heavy Industries, Ltd. Motion reduction apparatus and floating body therewith
US9302747B2 (en) 2013-04-10 2016-04-05 Technip France Floating offshore platform with pontoon-coupled extension plates for reduced heave motion

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0097656A4 (en) * 1982-01-04 1986-05-14 Gen Electric CONDUCTORS METALLIZED BY ELECTROLYSIS AND TREATED BY AN INCREASED REPLACEMENT PROCESS, AND THEIR MANUFACTURE.
US4692387A (en) * 1984-10-02 1987-09-08 E. I. Du Pont De Nemours And Company Sintering of metal interlayers within organic polymeric films
US4640981A (en) * 1984-10-04 1987-02-03 Amp Incorporated Electrical interconnection means
DE3515985A1 (de) * 1985-05-03 1986-11-06 Wilhelm Ruf KG, 8000 München Verfahren zur herstellung einer loetbaren beschichtung auf einem substrat und leiterbahnplatte bzw. loetbare kontaktflaeche
US4770921A (en) * 1986-09-11 1988-09-13 Insulating Materials Incorporated Self-shielding multi-layer circuit boards
DE3733002A1 (de) * 1986-09-30 1988-04-07 Wilde Membran Impuls Tech Additiv metallisierte elektrisch leitfaehige struktur
DE3810486A1 (de) * 1988-03-28 1989-10-19 Kaleto Ag Verfahren zum herstellen kundenspezifischer elektrischer schaltungen, insbesondere gedruckter schaltungen
US5043184A (en) * 1989-02-06 1991-08-27 Somar Corporation Method of forming electrically conducting layer
US6021050A (en) * 1998-12-02 2000-02-01 Bourns, Inc. Printed circuit boards with integrated passive components and method for making same
GB0117431D0 (en) * 2001-07-17 2001-09-12 Univ Brunel Method for printing conducting layer onto substrate
KR100783667B1 (ko) * 2006-08-10 2007-12-07 한국화학연구원 입자형 다결정 실리콘의 제조방법 및 제조장치
US8635767B2 (en) * 2011-01-05 2014-01-28 Thoe Boeing Company System for depositing microwire

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS528504A (en) * 1975-07-09 1977-01-22 Toshiba Corp Electro magnetic pump

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1301186B (de) * 1963-09-19 1969-08-14 Basf Ag Verfahren zur Metallisierung von Oberflaechen von Kunststoff-Gegenstaenden
DE1615784A1 (de) * 1967-08-16 1970-05-27 Basf Ag Verfahren zur Herstellung von elektrisch leitenden Schichten auf elektrisch nicht leitenden Oberflaechen
JPS5210568A (en) * 1974-12-28 1977-01-26 Hideo Machida Method of manufacturing multilayered printed wiring substrate
US4129488A (en) * 1976-11-08 1978-12-12 Scm Corporation Ultraviolet curable epoxy-polyester powder paints
FI783935A (fi) * 1978-12-20 1980-06-21 Outokumpu Oy Foerfarande foer belaeggning med metall av ett material som icke leder elektricitet

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS528504A (en) * 1975-07-09 1977-01-22 Toshiba Corp Electro magnetic pump

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4812886A (en) * 1987-02-09 1989-03-14 International Business Machines Corporation Multilayer contact apparatus and method
US7677838B2 (en) 2000-05-16 2010-03-16 Mitsubishi Heavy Industries, Ltd. Motion reduction apparatus and floating body therewith
JP2008062677A (ja) * 2006-09-04 2008-03-21 Ihi Marine United Inc 浮体の横揺れ低減構造
US9302747B2 (en) 2013-04-10 2016-04-05 Technip France Floating offshore platform with pontoon-coupled extension plates for reduced heave motion

Also Published As

Publication number Publication date
GB2090476A (en) 1982-07-07
MX151202A (es) 1984-10-09
US4416914A (en) 1983-11-22
GB2090476B (en) 1985-09-18
DE3151262A1 (de) 1982-07-29

Similar Documents

Publication Publication Date Title
DE3165502D1 (en) Multi-layered-solder and method of producing such solder
JPS5775401A (en) Electric circuit element and method of producing same
JPS57134998A (en) Multilayer array conductor and method of producing same
JPS5745925A (en) Method of forming conductor
JPS57126011A (en) Insulator unit and method of producing same
JPS57132340A (en) Semiconductor structure and method of producing same
JPS57141811A (en) Polyolefin series electrically insulating film and method of producing same
JPS57170047A (en) Commutator and method of producing same
JPS56103812A (en) Waterproof cable and method of manufacturing same
JPS57103214A (en) Insulating plate and method of producing same
JPS5717124A (en) Capacitor and method of producing same
JPS5769721A (en) Electronic element and method of producing same
JPS5758374A (en) Conductive element and method of producing same
JPS577112A (en) Composite circuit part and method of producing same
JPS5784512A (en) Lead wire and method of producing same
JPS5734605A (en) Method of producing conductor
JPS5798923A (en) Contact and method of producing same
JPS5780608A (en) Anosotropic conductive structure and method of producing same
JPS5769720A (en) Electronic element and method of producing same
JPS56138983A (en) Electric circuit unit and method of producing same
JPS5734604A (en) Method of producing conductor
JPS57194439A (en) Storage dielectric unit and method of producing same
JPS56132731A (en) Lead switch and method of producing same
JPS5790810A (en) Method of producing conductive laminated tape
JPS56165206A (en) Multicore superconductor and method of producing same