JPS57128160U - - Google Patents

Info

Publication number
JPS57128160U
JPS57128160U JP1527081U JP1527081U JPS57128160U JP S57128160 U JPS57128160 U JP S57128160U JP 1527081 U JP1527081 U JP 1527081U JP 1527081 U JP1527081 U JP 1527081U JP S57128160 U JPS57128160 U JP S57128160U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1527081U
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1527081U priority Critical patent/JPS57128160U/ja
Publication of JPS57128160U publication Critical patent/JPS57128160U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP1527081U 1981-02-04 1981-02-04 Pending JPS57128160U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1527081U JPS57128160U (ja) 1981-02-04 1981-02-04

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1527081U JPS57128160U (ja) 1981-02-04 1981-02-04

Publications (1)

Publication Number Publication Date
JPS57128160U true JPS57128160U (ja) 1982-08-10

Family

ID=29813272

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1527081U Pending JPS57128160U (ja) 1981-02-04 1981-02-04

Country Status (1)

Country Link
JP (1) JPS57128160U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0448662A (ja) * 1990-06-14 1992-02-18 Hitachi Cable Ltd 発光ダイオード・マイクロチップの実装方法
JP2016207757A (ja) * 2015-04-17 2016-12-08 シチズン電子株式会社 Ｌｅｄ発光装置およびその製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5037386A (ja) * 1973-08-06 1975-04-08
JPS54159A (en) * 1977-06-02 1979-01-05 Sankyo Seisakushiyo Kk Movement converting device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5037386A (ja) * 1973-08-06 1975-04-08
JPS54159A (en) * 1977-06-02 1979-01-05 Sankyo Seisakushiyo Kk Movement converting device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0448662A (ja) * 1990-06-14 1992-02-18 Hitachi Cable Ltd 発光ダイオード・マイクロチップの実装方法
JP2016207757A (ja) * 2015-04-17 2016-12-08 シチズン電子株式会社 Ｌｅｄ発光装置およびその製造方法

Similar Documents

Publication Publication Date Title
FR2500031B1 (ja)
FR2499119B1 (ja)
GR67756B (ja)
FR2500320B1 (ja)
FR2499717B1 (ja)
FR2498561B1 (ja)
DE8201798U1 (ja)
FR2500360B3 (ja)
FR2498162B1 (ja)
FR2497556B1 (ja)
FR2499774B1 (ja)
FR2498686B1 (ja)
FR2499302B1 (ja)
FR2499071B1 (ja)
FR2498907B3 (ja)
FR2499347B1 (ja)
FR2497742B1 (ja)
DE8133466U1 (ja)
FR2498919B3 (ja)
FR2500253B3 (ja)
FR2498877B1 (ja)
FR2497699B1 (ja)
FR2499702B3 (ja)
FR2498937B1 (ja)
JPS57143436U (ja)