JPS57128160U - - Google Patents
Info
- Publication number
- JPS57128160U JPS57128160U JP1527081U JP1527081U JPS57128160U JP S57128160 U JPS57128160 U JP S57128160U JP 1527081 U JP1527081 U JP 1527081U JP 1527081 U JP1527081 U JP 1527081U JP S57128160 U JPS57128160 U JP S57128160U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1527081U JPS57128160U (ja) | 1981-02-04 | 1981-02-04 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1527081U JPS57128160U (ja) | 1981-02-04 | 1981-02-04 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57128160U true JPS57128160U (ja) | 1982-08-10 |
Family
ID=29813272
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1527081U Pending JPS57128160U (ja) | 1981-02-04 | 1981-02-04 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57128160U (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0448662A (ja) * | 1990-06-14 | 1992-02-18 | Hitachi Cable Ltd | 発光ダイオード・マイクロチップの実装方法 |
JP2016207757A (ja) * | 2015-04-17 | 2016-12-08 | シチズン電子株式会社 | Led発光装置およびその製造方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5037386A (ja) * | 1973-08-06 | 1975-04-08 | ||
JPS54159A (en) * | 1977-06-02 | 1979-01-05 | Sankyo Seisakushiyo Kk | Movement converting device |
-
1981
- 1981-02-04 JP JP1527081U patent/JPS57128160U/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5037386A (ja) * | 1973-08-06 | 1975-04-08 | ||
JPS54159A (en) * | 1977-06-02 | 1979-01-05 | Sankyo Seisakushiyo Kk | Movement converting device |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0448662A (ja) * | 1990-06-14 | 1992-02-18 | Hitachi Cable Ltd | 発光ダイオード・マイクロチップの実装方法 |
JP2016207757A (ja) * | 2015-04-17 | 2016-12-08 | シチズン電子株式会社 | Led発光装置およびその製造方法 |