JPS57128143U - - Google Patents
Info
- Publication number
- JPS57128143U JPS57128143U JP1392681U JP1392681U JPS57128143U JP S57128143 U JPS57128143 U JP S57128143U JP 1392681 U JP1392681 U JP 1392681U JP 1392681 U JP1392681 U JP 1392681U JP S57128143 U JPS57128143 U JP S57128143U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1392681U JPS57128143U (enExample) | 1981-02-03 | 1981-02-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1392681U JPS57128143U (enExample) | 1981-02-03 | 1981-02-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS57128143U true JPS57128143U (enExample) | 1982-08-10 |
Family
ID=29811996
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1392681U Pending JPS57128143U (enExample) | 1981-02-03 | 1981-02-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57128143U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07335680A (ja) * | 1994-06-14 | 1995-12-22 | Fujitsu Ltd | 回路基板及びその製造方法、並びに半導体装置のワイヤボンディング方法及び半導体装置の封止方法 |
-
1981
- 1981-02-03 JP JP1392681U patent/JPS57128143U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07335680A (ja) * | 1994-06-14 | 1995-12-22 | Fujitsu Ltd | 回路基板及びその製造方法、並びに半導体装置のワイヤボンディング方法及び半導体装置の封止方法 |