JPS5712769U - - Google Patents
Info
- Publication number
- JPS5712769U JPS5712769U JP1980088686U JP8868680U JPS5712769U JP S5712769 U JPS5712769 U JP S5712769U JP 1980088686 U JP1980088686 U JP 1980088686U JP 8868680 U JP8868680 U JP 8868680U JP S5712769 U JPS5712769 U JP S5712769U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
- H01L2224/48139—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate with an intermediate bond, e.g. continuous wire daisy chain
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980088686U JPS5712769U (ru) | 1980-06-24 | 1980-06-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980088686U JPS5712769U (ru) | 1980-06-24 | 1980-06-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5712769U true JPS5712769U (ru) | 1982-01-22 |
Family
ID=29450759
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1980088686U Pending JPS5712769U (ru) | 1980-06-24 | 1980-06-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5712769U (ru) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59144859A (ja) * | 1983-01-28 | 1984-08-20 | クロス マニユフアクチユリング カンパニ−（１９３８）リミテツド | 回転可能な軸の密封装置 |
| JP2016184708A (ja) * | 2015-03-26 | 2016-10-20 | 日亜化学工業株式会社 | 発光装置 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4919786A (ru) * | 1972-03-01 | 1974-02-21 | ||
| JPS4968686A (ru) * | 1972-11-06 | 1974-07-03 |
-
1980
- 1980-06-24 JP JP1980088686U patent/JPS5712769U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4919786A (ru) * | 1972-03-01 | 1974-02-21 | ||
| JPS4968686A (ru) * | 1972-11-06 | 1974-07-03 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59144859A (ja) * | 1983-01-28 | 1984-08-20 | クロス マニユフアクチユリング カンパニ−（１９３８）リミテツド | 回転可能な軸の密封装置 |
| JPH052869B2 (ru) * | 1983-01-28 | 1993-01-13 | Cross Mfg Co 1938 Ltd | |
| JP2016184708A (ja) * | 2015-03-26 | 2016-10-20 | 日亜化学工業株式会社 | 発光装置 |
| US10553568B2 (en) | 2015-03-26 | 2020-02-04 | Nichia Corporation | Light emitting device |