JPS5712754U - - Google Patents
Info
- Publication number
- JPS5712754U JPS5712754U JP9017080U JP9017080U JPS5712754U JP S5712754 U JPS5712754 U JP S5712754U JP 9017080 U JP9017080 U JP 9017080U JP 9017080 U JP9017080 U JP 9017080U JP S5712754 U JPS5712754 U JP S5712754U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9017080U JPS5712754U (enExample) | 1980-06-26 | 1980-06-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9017080U JPS5712754U (enExample) | 1980-06-26 | 1980-06-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5712754U true JPS5712754U (enExample) | 1982-01-22 |
Family
ID=29452180
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9017080U Pending JPS5712754U (enExample) | 1980-06-26 | 1980-06-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5712754U (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6044647A (ja) * | 1983-08-23 | 1985-03-09 | イエアン・ヴアルテルシヤイト・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツング | カサ歯車伝動機構 |
| JPH02239651A (ja) * | 1989-03-13 | 1990-09-21 | Hitachi Ltd | 半導体装置およびその実装方法 |
| WO2002007220A1 (en) * | 2000-07-19 | 2002-01-24 | Shindo Company, Ltd. | Semiconductor device |
-
1980
- 1980-06-26 JP JP9017080U patent/JPS5712754U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6044647A (ja) * | 1983-08-23 | 1985-03-09 | イエアン・ヴアルテルシヤイト・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツング | カサ歯車伝動機構 |
| JPH02239651A (ja) * | 1989-03-13 | 1990-09-21 | Hitachi Ltd | 半導体装置およびその実装方法 |
| WO2002007220A1 (en) * | 2000-07-19 | 2002-01-24 | Shindo Company, Ltd. | Semiconductor device |
| CN100401517C (zh) * | 2000-07-19 | 2008-07-09 | 新藤电子工业株式会社 | 半导体装置 |