JPS5712532B2 - - Google Patents
Info
- Publication number
- JPS5712532B2 JPS5712532B2 JP13517176A JP13517176A JPS5712532B2 JP S5712532 B2 JPS5712532 B2 JP S5712532B2 JP 13517176 A JP13517176 A JP 13517176A JP 13517176 A JP13517176 A JP 13517176A JP S5712532 B2 JPS5712532 B2 JP S5712532B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13517176A JPS5360572A (en) | 1976-11-12 | 1976-11-12 | Ultrasonic wire bonding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13517176A JPS5360572A (en) | 1976-11-12 | 1976-11-12 | Ultrasonic wire bonding device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5360572A JPS5360572A (en) | 1978-05-31 |
| JPS5712532B2 true JPS5712532B2 (zh) | 1982-03-11 |
Family
ID=15145486
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13517176A Granted JPS5360572A (en) | 1976-11-12 | 1976-11-12 | Ultrasonic wire bonding device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5360572A (zh) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5732588Y2 (zh) * | 1977-03-03 | 1982-07-17 | ||
| JPS53144668A (en) * | 1977-05-23 | 1978-12-16 | Fujitsu Ltd | Locating mechanism |
| JPS577135A (en) * | 1980-06-16 | 1982-01-14 | Mitsubishi Electric Corp | Wire bonding apparatus |
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1976
- 1976-11-12 JP JP13517176A patent/JPS5360572A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5360572A (en) | 1978-05-31 |