JPS57124458A - Epoxy resin molding material for sealing semiconductor - Google Patents

Epoxy resin molding material for sealing semiconductor

Info

Publication number
JPS57124458A
JPS57124458A JP56009673A JP967381A JPS57124458A JP S57124458 A JPS57124458 A JP S57124458A JP 56009673 A JP56009673 A JP 56009673A JP 967381 A JP967381 A JP 967381A JP S57124458 A JPS57124458 A JP S57124458A
Authority
JP
Japan
Prior art keywords
epoxy resin
molding material
resin molding
alcoholate
chelate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56009673A
Other languages
Japanese (ja)
Inventor
Michiya Azuma
Shinetsu Fujieda
Akira Yoshizumi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP56009673A priority Critical patent/JPS57124458A/en
Publication of JPS57124458A publication Critical patent/JPS57124458A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To obtain wetproof property, corrosion resistance and mechanical strength by forming the epoxy resin molding material for sealing the semiconductor as an inorganic filler, the surface thereof is coated with the alcoholate or chelate of zirconium or aluminum. CONSTITUTION:The epoxy resin molding material for sealing the semiconductor contains the inorganic filler, the surface thereof is coated with the alcoholate or chelate of zirconium or aluminum and which is dried at the temperature of 300-450 deg.C. It is preferable that the alcoholate or chelate of zirconium or aluminum is coated within the range of 0.3-5.0pts.wt. to 100pts.wt. inorganic filler.
JP56009673A 1981-01-27 1981-01-27 Epoxy resin molding material for sealing semiconductor Pending JPS57124458A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56009673A JPS57124458A (en) 1981-01-27 1981-01-27 Epoxy resin molding material for sealing semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56009673A JPS57124458A (en) 1981-01-27 1981-01-27 Epoxy resin molding material for sealing semiconductor

Publications (1)

Publication Number Publication Date
JPS57124458A true JPS57124458A (en) 1982-08-03

Family

ID=11726723

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56009673A Pending JPS57124458A (en) 1981-01-27 1981-01-27 Epoxy resin molding material for sealing semiconductor

Country Status (1)

Country Link
JP (1) JPS57124458A (en)

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