JPS57121420A - Cutting oil splash prevention device for wire-cut spark erosion machine - Google Patents
Cutting oil splash prevention device for wire-cut spark erosion machineInfo
- Publication number
- JPS57121420A JPS57121420A JP277681A JP277681A JPS57121420A JP S57121420 A JPS57121420 A JP S57121420A JP 277681 A JP277681 A JP 277681A JP 277681 A JP277681 A JP 277681A JP S57121420 A JPS57121420 A JP S57121420A
- Authority
- JP
- Japan
- Prior art keywords
- cutting oil
- cylinder
- wire
- spark erosion
- splashing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
- B23H7/00—Processes or apparatus applicable to both electrical discharge machining and electrochemical machining
- B23H7/02—Wire-cutting
- B23H7/08—Wire electrodes
- B23H7/10—Supporting, winding or electrical connection of wire-electrode
- B23H7/101—Supply of working media
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
Abstract
PURPOSE:To prevent cutting oil from splashing by installing a cylindrical protector, that is movable up and down, around the nozzle through which the cutting oil is supplied to the location of the wire-cut spark erosion machining. CONSTITUTION:The cutting oil is supplied to the working location of the wire- cut spark erosion machining through a nozzle 14. A cylindrical protector 17 is installed freely slidable up and down by means of lengthy holes 18 and fixing screws 19. The cylinder 17 is always brought down by its own weight to touch the work 12, but at the same time lifted up slightly due to the pressure of cutting oil splashing to transverse directions. The pressure of cutting oil also acts on the gap between the top end of the cylinder 17 and the nozzle 14, and the cylinder status at a position of balance of these forces. Splashing of the cutting oil coming out of the bottom end of the cylinder is prevented due to viscous damping provided by the cutting oil falling down from the top end of the cylinder.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP277681A JPS57121420A (en) | 1981-01-12 | 1981-01-12 | Cutting oil splash prevention device for wire-cut spark erosion machine |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP277681A JPS57121420A (en) | 1981-01-12 | 1981-01-12 | Cutting oil splash prevention device for wire-cut spark erosion machine |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57121420A true JPS57121420A (en) | 1982-07-28 |
JPS6218288B2 JPS6218288B2 (en) | 1987-04-22 |
Family
ID=11538738
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP277681A Granted JPS57121420A (en) | 1981-01-12 | 1981-01-12 | Cutting oil splash prevention device for wire-cut spark erosion machine |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57121420A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62117022U (en) * | 1986-01-14 | 1987-07-25 | ||
US5086202A (en) * | 1989-10-23 | 1992-02-04 | Mitsubishi Denki K.K. | Wire guides for traveling wire type apparatus |
WO2011036924A1 (en) * | 2009-09-24 | 2011-03-31 | 三菱電機株式会社 | Wire electric discharge machining apparatus, wire electric discharge machining method, thin board manufacturing method and semiconductor wafer manufacturing method |
-
1981
- 1981-01-12 JP JP277681A patent/JPS57121420A/en active Granted
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62117022U (en) * | 1986-01-14 | 1987-07-25 | ||
US5086202A (en) * | 1989-10-23 | 1992-02-04 | Mitsubishi Denki K.K. | Wire guides for traveling wire type apparatus |
WO2011036924A1 (en) * | 2009-09-24 | 2011-03-31 | 三菱電機株式会社 | Wire electric discharge machining apparatus, wire electric discharge machining method, thin board manufacturing method and semiconductor wafer manufacturing method |
JP5172019B2 (en) * | 2009-09-24 | 2013-03-27 | 三菱電機株式会社 | Wire electric discharge machining apparatus, wire electric discharge machining method, thin plate manufacturing method, and semiconductor wafer manufacturing method |
US9950379B2 (en) | 2009-09-24 | 2018-04-24 | Mitsubishi Electric Corporation | Wire electric discharge machining apparatus |
Also Published As
Publication number | Publication date |
---|---|
JPS6218288B2 (en) | 1987-04-22 |
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