JPS57116772A - Working method for sputtering target body - Google Patents

Working method for sputtering target body

Info

Publication number
JPS57116772A
JPS57116772A JP305981A JP305981A JPS57116772A JP S57116772 A JPS57116772 A JP S57116772A JP 305981 A JP305981 A JP 305981A JP 305981 A JP305981 A JP 305981A JP S57116772 A JPS57116772 A JP S57116772A
Authority
JP
Japan
Prior art keywords
granular materials
target body
compressing
surface layer
sintering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP305981A
Other languages
Japanese (ja)
Inventor
Takaaki Kumochi
Saburo Nobutoki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP305981A priority Critical patent/JPS57116772A/en
Publication of JPS57116772A publication Critical patent/JPS57116772A/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

PURPOSE:To make the reuse of a sputtering target body formed from granular materials by means such as compressing and sintering possible by mechanically grinding off the surface layer worn down upon use. CONSTITUTION:A target body for forming sputtering films formed of means such as compressing, sintering or their combination from granular materials wears down upon use. When the contact parts of the granular materials with themselves wear down, the granular materials have easy tendency to separation and dislodging. The dislodged granular materials scatter or obtain mechanical energy upon impingement with ionizing gases, thereby damaging the substrate surface. Thereupon, the surface layer where the granular materials are liable to dislodge is mechanically ground off and the grinding debris is thoroughly removed with a self-adhesive tape or the like. In this way, the costly target body is reused, the production cost of transparent conductive films is lowered and the quality and yield thereof are improved.
JP305981A 1981-01-14 1981-01-14 Working method for sputtering target body Pending JPS57116772A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP305981A JPS57116772A (en) 1981-01-14 1981-01-14 Working method for sputtering target body

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP305981A JPS57116772A (en) 1981-01-14 1981-01-14 Working method for sputtering target body

Publications (1)

Publication Number Publication Date
JPS57116772A true JPS57116772A (en) 1982-07-20

Family

ID=11546746

Family Applications (1)

Application Number Title Priority Date Filing Date
JP305981A Pending JPS57116772A (en) 1981-01-14 1981-01-14 Working method for sputtering target body

Country Status (1)

Country Link
JP (1) JPS57116772A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19847191C2 (en) * 1997-10-13 2002-06-20 Japan Energy Corp ITO atomization target and its cleaning process

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19847191C2 (en) * 1997-10-13 2002-06-20 Japan Energy Corp ITO atomization target and its cleaning process

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