JPS57115253U - - Google Patents

Info

Publication number
JPS57115253U
JPS57115253U JP1981001247U JP124781U JPS57115253U JP S57115253 U JPS57115253 U JP S57115253U JP 1981001247 U JP1981001247 U JP 1981001247U JP 124781 U JP124781 U JP 124781U JP S57115253 U JPS57115253 U JP S57115253U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1981001247U
Other languages
Japanese (ja)
Other versions
JPS6334281Y2 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1981001247U priority Critical patent/JPS6334281Y2/ja
Publication of JPS57115253U publication Critical patent/JPS57115253U/ja
Application granted granted Critical
Publication of JPS6334281Y2 publication Critical patent/JPS6334281Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/531Shapes of wire connectors
    • H10W72/536Shapes of wire connectors the connected ends being ball-shaped
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/531Shapes of wire connectors
    • H10W72/5363Shapes of wire connectors the connected ends being wedge-shaped
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/851Dispositions of multiple connectors or interconnections
    • H10W72/874On different surfaces
    • H10W72/884Die-attach connectors and bond wires
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00Encapsulations, e.g. protective coatings
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
JP1981001247U 1981-01-07 1981-01-07 Expired JPS6334281Y2 (https=)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981001247U JPS6334281Y2 (https=) 1981-01-07 1981-01-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981001247U JPS6334281Y2 (https=) 1981-01-07 1981-01-07

Publications (2)

Publication Number Publication Date
JPS57115253U true JPS57115253U (https=) 1982-07-16
JPS6334281Y2 JPS6334281Y2 (https=) 1988-09-12

Family

ID=29799735

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981001247U Expired JPS6334281Y2 (https=) 1981-01-07 1981-01-07

Country Status (1)

Country Link
JP (1) JPS6334281Y2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008146531A1 (ja) * 2007-05-29 2008-12-04 Kyocera Corporation 電子部品収納用パッケージ、及び電子装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008146531A1 (ja) * 2007-05-29 2008-12-04 Kyocera Corporation 電子部品収納用パッケージ、及び電子装置
JP5106528B2 (ja) * 2007-05-29 2012-12-26 京セラ株式会社 電子部品収納用パッケージ、及び電子装置

Also Published As

Publication number Publication date
JPS6334281Y2 (https=) 1988-09-12

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