JPS57115242U - - Google Patents
Info
- Publication number
- JPS57115242U JPS57115242U JP182481U JP182481U JPS57115242U JP S57115242 U JPS57115242 U JP S57115242U JP 182481 U JP182481 U JP 182481U JP 182481 U JP182481 U JP 182481U JP S57115242 U JPS57115242 U JP S57115242U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP182481U JPS57115242U (cs) | 1981-01-07 | 1981-01-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP182481U JPS57115242U (cs) | 1981-01-07 | 1981-01-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS57115242U true JPS57115242U (cs) | 1982-07-16 |
Family
ID=29800257
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP182481U Pending JPS57115242U (cs) | 1981-01-07 | 1981-01-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57115242U (cs) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5831551A (ja) * | 1981-08-19 | 1983-02-24 | Nec Corp | ペレツト位置検出装置 |
| JPS6276728A (ja) * | 1985-09-30 | 1987-04-08 | Toshiba Corp | 半導体ペレツトマウント装置 |
| JPH02137339A (ja) * | 1988-11-18 | 1990-05-25 | Hitachi Ltd | ペレットボンディング方法およびその装置 |
-
1981
- 1981-01-07 JP JP182481U patent/JPS57115242U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5831551A (ja) * | 1981-08-19 | 1983-02-24 | Nec Corp | ペレツト位置検出装置 |
| JPS6276728A (ja) * | 1985-09-30 | 1987-04-08 | Toshiba Corp | 半導体ペレツトマウント装置 |
| JPH02137339A (ja) * | 1988-11-18 | 1990-05-25 | Hitachi Ltd | ペレットボンディング方法およびその装置 |