JPS5711497B2 - - Google Patents

Info

Publication number
JPS5711497B2
JPS5711497B2 JP4162176A JP4162176A JPS5711497B2 JP S5711497 B2 JPS5711497 B2 JP S5711497B2 JP 4162176 A JP4162176 A JP 4162176A JP 4162176 A JP4162176 A JP 4162176A JP S5711497 B2 JPS5711497 B2 JP S5711497B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP4162176A
Other languages
Japanese (ja)
Other versions
JPS52124864A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4162176A priority Critical patent/JPS52124864A/ja
Publication of JPS52124864A publication Critical patent/JPS52124864A/ja
Publication of JPS5711497B2 publication Critical patent/JPS5711497B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78343—Means for applying energy, e.g. heating means by means of pressure by ultrasonic vibrations
    • H01L2224/78344—Eccentric cams
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP4162176A 1976-04-13 1976-04-13 Wireebonder Granted JPS52124864A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4162176A JPS52124864A (en) 1976-04-13 1976-04-13 Wireebonder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4162176A JPS52124864A (en) 1976-04-13 1976-04-13 Wireebonder

Publications (2)

Publication Number Publication Date
JPS52124864A JPS52124864A (en) 1977-10-20
JPS5711497B2 true JPS5711497B2 (enrdf_load_stackoverflow) 1982-03-04

Family

ID=12613397

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4162176A Granted JPS52124864A (en) 1976-04-13 1976-04-13 Wireebonder

Country Status (1)

Country Link
JP (1) JPS52124864A (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57121243A (en) * 1981-01-21 1982-07-28 Shinkawa Ltd Load variable mechanism at wire bonder
JPS57188840A (en) * 1981-05-15 1982-11-19 Shinkawa Ltd Load variable mechanism in wire bonder

Also Published As

Publication number Publication date
JPS52124864A (en) 1977-10-20

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