JPS57106036A - Cutter for semiconductor crystal - Google Patents
Cutter for semiconductor crystalInfo
- Publication number
- JPS57106036A JPS57106036A JP18327180A JP18327180A JPS57106036A JP S57106036 A JPS57106036 A JP S57106036A JP 18327180 A JP18327180 A JP 18327180A JP 18327180 A JP18327180 A JP 18327180A JP S57106036 A JPS57106036 A JP S57106036A
- Authority
- JP
- Japan
- Prior art keywords
- saw
- cleavage plane
- spot
- parallel
- crystal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
PURPOSE:To make a saw and a cleavage plane parallel by a method wherein the spot of a laser beam is projected on a screen after a saw is placed on a table and the spot of the laser beam applied to the cleavage plane of a crystal which is placed on the table is projected on the screen and is made agree with the previous one by rotating the table. CONSTITUTION:A blade 18 of a saw 19 touches a table 14 on the surface, arms 21, 22 are moved, a mirror 20 adhered to the saw 19 is parallel to it is irradiated by a laser source 23 and a spot A is obtained on a screen 26. Then a single crystal 24 is placed on the table 14, the arms 21, 22 are fixed, the cleavage plane 25 of the crystal 24 is irradiated by the source 23 and a spot A' of reflected light is obtained. The table is rotated until the point A' agrees with the point A. At that time the cleavage plane and the face of the blade 18 are in parallel. The saw 19 descends and cuts the crystal and at each cutting tables 12, 13 are very slightly, so that wafers are cut out. With above configuration cutting is made in parallel with the cleavage plane and the yield of the elements is improved.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18327180A JPS57106036A (en) | 1980-12-23 | 1980-12-23 | Cutter for semiconductor crystal |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18327180A JPS57106036A (en) | 1980-12-23 | 1980-12-23 | Cutter for semiconductor crystal |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57106036A true JPS57106036A (en) | 1982-07-01 |
Family
ID=16132730
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18327180A Pending JPS57106036A (en) | 1980-12-23 | 1980-12-23 | Cutter for semiconductor crystal |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57106036A (en) |
-
1980
- 1980-12-23 JP JP18327180A patent/JPS57106036A/en active Pending
Similar Documents
Publication | Publication Date | Title |
---|---|---|
SE8402037L (en) | PROCEDURE AND DEVICE FOR CUTTING REDUCE THE SPECIFIC SPECIFICATION OF THREE AND SIMILAR MATERIALS | |
US4546231A (en) | Creation of a parting zone in a crystal structure | |
CA2245472A1 (en) | Apparatus for automatic layout and cutting corner lines in stone | |
GB1441114A (en) | Method of and apparatus for severing vitreous bodies | |
JPH03258476A (en) | Laser cutting method and device | |
GB1441650A (en) | Method of and apparatus for severing vitreous sheets | |
JPS6239539B2 (en) | ||
ES277340Y (en) | A PERFECT SHAVING MACHINE | |
JPS57106036A (en) | Cutter for semiconductor crystal | |
JPS60244493A (en) | Cutter marking combination use of disk-shaped blade and laser beam processing | |
JPS57100889A (en) | Laser working device | |
ATE217232T1 (en) | METHOD FOR CUTTING Y BEVELS | |
JPS55151351A (en) | Cutting method of semiconductor chip | |
JPS54109376A (en) | Cutting method of semiconductor wafer and its unit | |
JPS566451A (en) | Deviding method of semiconductor device | |
JPS57181787A (en) | Laser working method | |
EP0181431A3 (en) | Method for cutting up work pieces by sawing | |
JPS5916343A (en) | Scribing method for sos wafer | |
JPS5497008A (en) | Floating type magnetic head | |
SU1151384A2 (en) | Method of producing circular saws | |
JPS5752585A (en) | Laser cutting method | |
SU1660985A1 (en) | Cutter of stone circular saw | |
ES251512U (en) | Improvements in endless rotating blades for band-saws. | |
SU714246A1 (en) | Method of investigating the adhesion force between film and substrate | |
JPS5662334A (en) | Production of semiconductor |