JPS57106036A - Cutter for semiconductor crystal - Google Patents

Cutter for semiconductor crystal

Info

Publication number
JPS57106036A
JPS57106036A JP18327180A JP18327180A JPS57106036A JP S57106036 A JPS57106036 A JP S57106036A JP 18327180 A JP18327180 A JP 18327180A JP 18327180 A JP18327180 A JP 18327180A JP S57106036 A JPS57106036 A JP S57106036A
Authority
JP
Japan
Prior art keywords
saw
cleavage plane
spot
parallel
crystal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18327180A
Other languages
Japanese (ja)
Inventor
Yoshito Nishijima
Kosaku Yamamoto
Yoshio Kawabata
Hirokazu Fukuda
Kouji Shinohara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP18327180A priority Critical patent/JPS57106036A/en
Publication of JPS57106036A publication Critical patent/JPS57106036A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

PURPOSE:To make a saw and a cleavage plane parallel by a method wherein the spot of a laser beam is projected on a screen after a saw is placed on a table and the spot of the laser beam applied to the cleavage plane of a crystal which is placed on the table is projected on the screen and is made agree with the previous one by rotating the table. CONSTITUTION:A blade 18 of a saw 19 touches a table 14 on the surface, arms 21, 22 are moved, a mirror 20 adhered to the saw 19 is parallel to it is irradiated by a laser source 23 and a spot A is obtained on a screen 26. Then a single crystal 24 is placed on the table 14, the arms 21, 22 are fixed, the cleavage plane 25 of the crystal 24 is irradiated by the source 23 and a spot A' of reflected light is obtained. The table is rotated until the point A' agrees with the point A. At that time the cleavage plane and the face of the blade 18 are in parallel. The saw 19 descends and cuts the crystal and at each cutting tables 12, 13 are very slightly, so that wafers are cut out. With above configuration cutting is made in parallel with the cleavage plane and the yield of the elements is improved.
JP18327180A 1980-12-23 1980-12-23 Cutter for semiconductor crystal Pending JPS57106036A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18327180A JPS57106036A (en) 1980-12-23 1980-12-23 Cutter for semiconductor crystal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18327180A JPS57106036A (en) 1980-12-23 1980-12-23 Cutter for semiconductor crystal

Publications (1)

Publication Number Publication Date
JPS57106036A true JPS57106036A (en) 1982-07-01

Family

ID=16132730

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18327180A Pending JPS57106036A (en) 1980-12-23 1980-12-23 Cutter for semiconductor crystal

Country Status (1)

Country Link
JP (1) JPS57106036A (en)

Similar Documents

Publication Publication Date Title
SE8402037L (en) PROCEDURE AND DEVICE FOR CUTTING REDUCE THE SPECIFIC SPECIFICATION OF THREE AND SIMILAR MATERIALS
US4546231A (en) Creation of a parting zone in a crystal structure
CA2245472A1 (en) Apparatus for automatic layout and cutting corner lines in stone
GB1441114A (en) Method of and apparatus for severing vitreous bodies
JPH03258476A (en) Laser cutting method and device
GB1441650A (en) Method of and apparatus for severing vitreous sheets
JPS6239539B2 (en)
ES277340Y (en) A PERFECT SHAVING MACHINE
JPS57106036A (en) Cutter for semiconductor crystal
JPS60244493A (en) Cutter marking combination use of disk-shaped blade and laser beam processing
JPS57100889A (en) Laser working device
ATE217232T1 (en) METHOD FOR CUTTING Y BEVELS
JPS55151351A (en) Cutting method of semiconductor chip
JPS54109376A (en) Cutting method of semiconductor wafer and its unit
JPS566451A (en) Deviding method of semiconductor device
JPS57181787A (en) Laser working method
EP0181431A3 (en) Method for cutting up work pieces by sawing
JPS5916343A (en) Scribing method for sos wafer
JPS5497008A (en) Floating type magnetic head
SU1151384A2 (en) Method of producing circular saws
JPS5752585A (en) Laser cutting method
SU1660985A1 (en) Cutter of stone circular saw
ES251512U (en) Improvements in endless rotating blades for band-saws.
SU714246A1 (en) Method of investigating the adhesion force between film and substrate
JPS5662334A (en) Production of semiconductor