JPS5710575B2 - - Google Patents

Info

Publication number
JPS5710575B2
JPS5710575B2 JP13775373A JP13775373A JPS5710575B2 JP S5710575 B2 JPS5710575 B2 JP S5710575B2 JP 13775373 A JP13775373 A JP 13775373A JP 13775373 A JP13775373 A JP 13775373A JP S5710575 B2 JPS5710575 B2 JP S5710575B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP13775373A
Other languages
Japanese (ja)
Other versions
JPS5091268A (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13775373A priority Critical patent/JPS5710575B2/ja
Publication of JPS5091268A publication Critical patent/JPS5091268A/ja
Publication of JPS5710575B2 publication Critical patent/JPS5710575B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP13775373A 1973-12-12 1973-12-12 Expired JPS5710575B2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13775373A JPS5710575B2 (enrdf_load_stackoverflow) 1973-12-12 1973-12-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13775373A JPS5710575B2 (enrdf_load_stackoverflow) 1973-12-12 1973-12-12

Publications (2)

Publication Number Publication Date
JPS5091268A JPS5091268A (enrdf_load_stackoverflow) 1975-07-21
JPS5710575B2 true JPS5710575B2 (enrdf_load_stackoverflow) 1982-02-26

Family

ID=15206018

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13775373A Expired JPS5710575B2 (enrdf_load_stackoverflow) 1973-12-12 1973-12-12

Country Status (1)

Country Link
JP (1) JPS5710575B2 (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4832996A (en) * 1988-02-24 1989-05-23 Motorola, Inc. Semiconductor die for plastic encapsulation having an adhesion promoter

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1235413A (en) * 1968-01-26 1971-06-16 Dexter Corp Epoxy resin encapsulant compositions for semiconductors

Also Published As

Publication number Publication date
JPS5091268A (enrdf_load_stackoverflow) 1975-07-21

Similar Documents

Publication Publication Date Title
AR201758A1 (enrdf_load_stackoverflow)
AU476761B2 (enrdf_load_stackoverflow)
AU465372B2 (enrdf_load_stackoverflow)
AR201235Q (enrdf_load_stackoverflow)
AR201231Q (enrdf_load_stackoverflow)
AU474593B2 (enrdf_load_stackoverflow)
AU474511B2 (enrdf_load_stackoverflow)
AU474838B2 (enrdf_load_stackoverflow)
AU465453B2 (enrdf_load_stackoverflow)
AU471343B2 (enrdf_load_stackoverflow)
AU465434B2 (enrdf_load_stackoverflow)
JPS5128840B2 (enrdf_load_stackoverflow)
AU450229B2 (enrdf_load_stackoverflow)
AU476714B2 (enrdf_load_stackoverflow)
AR201229Q (enrdf_load_stackoverflow)
AR199451A1 (enrdf_load_stackoverflow)
AU476696B2 (enrdf_load_stackoverflow)
AU472848B2 (enrdf_load_stackoverflow)
AU466283B2 (enrdf_load_stackoverflow)
AU477823B2 (enrdf_load_stackoverflow)
JPS5091268A (enrdf_load_stackoverflow)
AR195311A1 (enrdf_load_stackoverflow)
AR201432A1 (enrdf_load_stackoverflow)
AR197627A1 (enrdf_load_stackoverflow)
AR196382A1 (enrdf_load_stackoverflow)