JPS57105310A - Bonding device by vacuum press - Google Patents

Bonding device by vacuum press

Info

Publication number
JPS57105310A
JPS57105310A JP55181216A JP18121680A JPS57105310A JP S57105310 A JPS57105310 A JP S57105310A JP 55181216 A JP55181216 A JP 55181216A JP 18121680 A JP18121680 A JP 18121680A JP S57105310 A JPS57105310 A JP S57105310A
Authority
JP
Japan
Prior art keywords
chamber
sheet
elastic sheet
space
heater
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP55181216A
Other languages
Japanese (ja)
Other versions
JPS6058014B2 (en
Inventor
Motohiko Kitsukawa
Atsuo Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hashimoto Forming Industry Co Ltd
Original Assignee
Hashimoto Forming Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hashimoto Forming Industry Co Ltd filed Critical Hashimoto Forming Industry Co Ltd
Priority to JP55181216A priority Critical patent/JPS6058014B2/en
Publication of JPS57105310A publication Critical patent/JPS57105310A/en
Publication of JPS6058014B2 publication Critical patent/JPS6058014B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Lining Or Joining Of Plastics Or The Like (AREA)

Abstract

PURPOSE: To control an elastic sheet at a higher efficiency and supply heat to the sheet rapidly by a method wherein a partition plate for partitioning the interior of a chamber on the upper side into an upper and a lower part is provided, and the volume of a control space for controlling an elastic sheet provided on the lower side of the chamber is reduced.
CONSTITUTION: An upper chamber 14 moved in the vertical direction by a cylinder 13 is positioned above a lower chamber 11 having a space for containing a work 12. A heater 15 is fixed in the opening of the upper chamber 14, and the elastic sheet 19 is provided on the lower end side of the chamber 14 so as to close the interior space of the chamber 14. Inside the chamber 14, the partition plate 21 having a hole 20 in its central part is provided so as to partition the interior space of the chamber 14 into the upper part on the heater 15 side and the lower part on the sheet 19 side. By heating the elastic sheet 19 and pressing it against a tape 16, the tape 16 can be heated in a short period of time and the amount of air required for controlling the sheet 19 can be reduced.
COPYRIGHT: (C)1982,JPO&Japio
JP55181216A 1980-12-23 1980-12-23 Vacuum press bonding equipment Expired JPS6058014B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55181216A JPS6058014B2 (en) 1980-12-23 1980-12-23 Vacuum press bonding equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55181216A JPS6058014B2 (en) 1980-12-23 1980-12-23 Vacuum press bonding equipment

Publications (2)

Publication Number Publication Date
JPS57105310A true JPS57105310A (en) 1982-06-30
JPS6058014B2 JPS6058014B2 (en) 1985-12-18

Family

ID=16096847

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55181216A Expired JPS6058014B2 (en) 1980-12-23 1980-12-23 Vacuum press bonding equipment

Country Status (1)

Country Link
JP (1) JPS6058014B2 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6389327A (en) * 1986-10-02 1988-04-20 Stanley Electric Co Ltd Thermocompression bonding device
US5094709A (en) * 1986-09-26 1992-03-10 General Electric Company Apparatus for packaging integrated circuit chips employing a polymer film overlay layer
US7001659B2 (en) 2000-02-10 2006-02-21 Dai Nippon Printing Co., Ltd. Decorative sheet for in-mold decorating injection molding, decorative molding and in-mold decorating injection molding method
US7537670B2 (en) 2003-09-16 2009-05-26 Canon Kabushiki Kaisha Thermal contact-bonding method and thermal contact-bonding apparatus
CN107487062A (en) * 2017-09-27 2017-12-19 华霆（合肥）动力技术有限公司 auxiliary sticking device
US10730268B2 (en) 2012-12-27 2020-08-04 3M Innovative Properties Company Decorative laminated sheet, structure including the decorative laminated sheet, and method of manufacturing the same
WO2022113424A1 (en) * 2020-11-30 2022-06-02 株式会社イルミネーション Hot stamp forming device and hot stamp forming method

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019142110A (en) * 2018-02-21 2019-08-29 日本ポリプロ株式会社 Decorative molding and method for producing the same
WO2021024763A1 (en) * 2019-08-07 2021-02-11 テイ・エス テック株式会社 Decorative member production method

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5094709A (en) * 1986-09-26 1992-03-10 General Electric Company Apparatus for packaging integrated circuit chips employing a polymer film overlay layer
JPS6389327A (en) * 1986-10-02 1988-04-20 Stanley Electric Co Ltd Thermocompression bonding device
US7001659B2 (en) 2000-02-10 2006-02-21 Dai Nippon Printing Co., Ltd. Decorative sheet for in-mold decorating injection molding, decorative molding and in-mold decorating injection molding method
US7318905B2 (en) 2000-02-10 2008-01-15 Dai Nippon Printing Co., Ltd. Decorative sheet for in-mold decorating injection molding, decorative molding and in-mold decorating injection molding method
US7537670B2 (en) 2003-09-16 2009-05-26 Canon Kabushiki Kaisha Thermal contact-bonding method and thermal contact-bonding apparatus
US10730268B2 (en) 2012-12-27 2020-08-04 3M Innovative Properties Company Decorative laminated sheet, structure including the decorative laminated sheet, and method of manufacturing the same
CN107487062A (en) * 2017-09-27 2017-12-19 华霆（合肥）动力技术有限公司 auxiliary sticking device
CN107487062B (en) * 2017-09-27 2019-06-18 华霆（合肥）动力技术有限公司 Auxiliary sticking device
WO2022113424A1 (en) * 2020-11-30 2022-06-02 株式会社イルミネーション Hot stamp forming device and hot stamp forming method
JP2022086934A (en) * 2020-11-30 2022-06-09 株式会社イルミネーション Hot stamp forming device and hot stamp forming method

Also Published As

Publication number Publication date
JPS6058014B2 (en) 1985-12-18

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