JPS5710259A - Full-wave rectifier - Google Patents

Full-wave rectifier

Info

Publication number
JPS5710259A
JPS5710259A JP8272780A JP8272780A JPS5710259A JP S5710259 A JPS5710259 A JP S5710259A JP 8272780 A JP8272780 A JP 8272780A JP 8272780 A JP8272780 A JP 8272780A JP S5710259 A JPS5710259 A JP S5710259A
Authority
JP
Japan
Prior art keywords
electrode
elements
electrodes
type elements
auxiliary
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8272780A
Other languages
Japanese (ja)
Inventor
Kazutoyo Narita
Tadashi Sakagami
Noboru Kawasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP8272780A priority Critical patent/JPS5710259A/en
Publication of JPS5710259A publication Critical patent/JPS5710259A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/072Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191Disposition
    • H01L2924/19101Disposition of discrete passive components
    • H01L2924/19107Disposition of discrete passive components off-chip wires

Abstract

PURPOSE:To facilitate wire connection and to enhance breakdown resistant property and insulating property, by connecting one set of electrodes of a plurality of elements to auxiliary electrodes in parallel, and fixing a plurality of the auxiliary electrodes to common heat radiating electrodes directly or through an insulator corresponding to the rectifying direction. CONSTITUTION:A three-phase full-wave rectifier is constituted by main circuits each comprising three P type elements P1, P2, and P3 and N type elements N1, N2, and N3, and an auxiliary circuit comprising P type elements P4, P5, and P6. Three elements in said circuits are connected to auxiliary electrode plates 14a-14c on which chip containing parts and output terminal parts are provided. One electrode thereof is brazed, and the other electrode is connected to a lead wire 6. The electrode plate 14a on which N type elements are mounted are directly brazed, and the electrode plate 14b and 14c are fixed via an insulating spacer 15a and 15b. Then, three phase inputs W, U, and V are connected to the leads 6 as shown by the dotted lines. The DC outputs are outputted from the electrode plates 14a and 14b. In this constitution, the rectifier, wherein wire connection is easy, and the breakdown resistant property and insulating property are enhanced, can be obtained.
JP8272780A 1980-06-20 1980-06-20 Full-wave rectifier Pending JPS5710259A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8272780A JPS5710259A (en) 1980-06-20 1980-06-20 Full-wave rectifier

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8272780A JPS5710259A (en) 1980-06-20 1980-06-20 Full-wave rectifier

Publications (1)

Publication Number Publication Date
JPS5710259A true JPS5710259A (en) 1982-01-19

Family

ID=13782443

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8272780A Pending JPS5710259A (en) 1980-06-20 1980-06-20 Full-wave rectifier

Country Status (1)

Country Link
JP (1) JPS5710259A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6117670A (en) * 1984-07-03 1986-01-25 株式会社竹中工務店 Longitudinal prestressed concrete construction method by pc cable
US5730111A (en) * 1995-06-15 1998-03-24 Nippondenso Co., Ltd. Air-fuel ratio control system for internal combustion engine

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6117670A (en) * 1984-07-03 1986-01-25 株式会社竹中工務店 Longitudinal prestressed concrete construction method by pc cable
US5730111A (en) * 1995-06-15 1998-03-24 Nippondenso Co., Ltd. Air-fuel ratio control system for internal combustion engine

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