JPS57102146U - - Google Patents
Info
- Publication number
- JPS57102146U JPS57102146U JP1980178320U JP17832080U JPS57102146U JP S57102146 U JPS57102146 U JP S57102146U JP 1980178320 U JP1980178320 U JP 1980178320U JP 17832080 U JP17832080 U JP 17832080U JP S57102146 U JPS57102146 U JP S57102146U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Ceramic Products (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980178320U JPH025542Y2 (enExample) | 1980-12-12 | 1980-12-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980178320U JPH025542Y2 (enExample) | 1980-12-12 | 1980-12-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57102146U true JPS57102146U (enExample) | 1982-06-23 |
| JPH025542Y2 JPH025542Y2 (enExample) | 1990-02-09 |
Family
ID=29973004
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1980178320U Expired JPH025542Y2 (enExample) | 1980-12-12 | 1980-12-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH025542Y2 (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60138991A (ja) * | 1983-12-27 | 1985-07-23 | 田中貴金属工業株式会社 | リ−ド端子用ろう材付帯材 |
| JP2008044009A (ja) * | 2006-07-19 | 2008-02-28 | Honda Motor Co Ltd | 熱膨張係数が異なる部材の接合方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS521066U (enExample) * | 1975-06-23 | 1977-01-06 |
-
1980
- 1980-12-12 JP JP1980178320U patent/JPH025542Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS521066U (enExample) * | 1975-06-23 | 1977-01-06 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60138991A (ja) * | 1983-12-27 | 1985-07-23 | 田中貴金属工業株式会社 | リ−ド端子用ろう材付帯材 |
| JP2008044009A (ja) * | 2006-07-19 | 2008-02-28 | Honda Motor Co Ltd | 熱膨張係数が異なる部材の接合方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH025542Y2 (enExample) | 1990-02-09 |