JPS57102145U - - Google Patents
Info
- Publication number
- JPS57102145U JPS57102145U JP1980178191U JP17819180U JPS57102145U JP S57102145 U JPS57102145 U JP S57102145U JP 1980178191 U JP1980178191 U JP 1980178191U JP 17819180 U JP17819180 U JP 17819180U JP S57102145 U JPS57102145 U JP S57102145U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980178191U JPS57102145U (ref) | 1980-12-12 | 1980-12-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980178191U JPS57102145U (ref) | 1980-12-12 | 1980-12-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS57102145U true JPS57102145U (ref) | 1982-06-23 |
Family
ID=29972761
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1980178191U Pending JPS57102145U (ref) | 1980-12-12 | 1980-12-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57102145U (ref) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58196859U (ja) * | 1982-06-26 | 1983-12-27 | 日本電気株式会社 | 半導体搭載用パツケ−ジの端子部構造 |
-
1980
- 1980-12-12 JP JP1980178191U patent/JPS57102145U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58196859U (ja) * | 1982-06-26 | 1983-12-27 | 日本電気株式会社 | 半導体搭載用パツケ−ジの端子部構造 |