JPS57100867A - Method and device for soldering - Google Patents
Method and device for solderingInfo
- Publication number
- JPS57100867A JPS57100867A JP55177206A JP17720680A JPS57100867A JP S57100867 A JPS57100867 A JP S57100867A JP 55177206 A JP55177206 A JP 55177206A JP 17720680 A JP17720680 A JP 17720680A JP S57100867 A JPS57100867 A JP S57100867A
- Authority
- JP
- Japan
- Prior art keywords
- terminals
- land
- block
- liquid
- leading end
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
PURPOSE: To perform the work of soldering the terminals of integrated circuits to the land of a printed wiring board efficiently and improve reliability by supplying heat to objects to be soldered by means of heated liquid as a heating medium.
CONSTITUTION: The respective terminals of an integrated circuit 1 to be soldered are positioned to the corresponding positions of a land 4 provided to a printed wiring board 3, and when an arm 12 supporting a block 15 for thermal pressure welding is lowered, the leading end of the block 15 contacts the terminals 2 mechanically. Liquid 19 is injected into the block 15 through a liquid injection port 18, for the former of which the liquid which evaporates less or does not evaporate at the melting temp. of the solder when heated in passing through a flow passage is used. When the leading end of the block 15 contacts the terminals 2, the heated liquid flows out through the opening at the leading end to around the terminals 2, and by the heat thereof, the solder stuck on the surfaces of the terminals 2 and the land 4 is melted, whereby the soldering of the terminals 2 arrayed in one row and the land 4 is accomplished at one time.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55177206A JPS58951B2 (en) | 1980-12-17 | 1980-12-17 | Soldering method and soldering equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55177206A JPS58951B2 (en) | 1980-12-17 | 1980-12-17 | Soldering method and soldering equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57100867A true JPS57100867A (en) | 1982-06-23 |
JPS58951B2 JPS58951B2 (en) | 1983-01-08 |
Family
ID=16027023
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP55177206A Expired JPS58951B2 (en) | 1980-12-17 | 1980-12-17 | Soldering method and soldering equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58951B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61232058A (en) * | 1985-04-09 | 1986-10-16 | Kenji Kondo | Jointing method of articles by welding |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4943638A (en) * | 1972-08-29 | 1974-04-24 | ||
JPS5039137A (en) * | 1973-08-09 | 1975-04-11 | ||
JPS5099138A (en) * | 1973-12-28 | 1975-08-06 | ||
JPS50127631A (en) * | 1974-03-14 | 1975-10-07 | ||
JPS51135533A (en) * | 1975-05-19 | 1976-11-24 | Fuji Photo Film Co Ltd | Sound recording device of sound movie camera |
JPS55102991A (en) * | 1979-02-01 | 1980-08-06 | Alps Electric Co Ltd | Adjusting device for directivity of microphone |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5086455A (en) * | 1973-12-07 | 1975-07-11 | ||
JPS5319563A (en) * | 1976-08-05 | 1978-02-22 | Nippon Aviotronics Kk | Method and device for soldering integrated circuit |
-
1980
- 1980-12-17 JP JP55177206A patent/JPS58951B2/en not_active Expired
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4943638A (en) * | 1972-08-29 | 1974-04-24 | ||
JPS5039137A (en) * | 1973-08-09 | 1975-04-11 | ||
JPS5099138A (en) * | 1973-12-28 | 1975-08-06 | ||
JPS50127631A (en) * | 1974-03-14 | 1975-10-07 | ||
JPS51135533A (en) * | 1975-05-19 | 1976-11-24 | Fuji Photo Film Co Ltd | Sound recording device of sound movie camera |
JPS55102991A (en) * | 1979-02-01 | 1980-08-06 | Alps Electric Co Ltd | Adjusting device for directivity of microphone |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61232058A (en) * | 1985-04-09 | 1986-10-16 | Kenji Kondo | Jointing method of articles by welding |
Also Published As
Publication number | Publication date |
---|---|
JPS58951B2 (en) | 1983-01-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6453537B1 (en) | Cooling method for electronic components | |
JP3359974B2 (en) | Soldering / soldering equipment, especially for integrated circuits | |
KR860003756A (en) | Electronic circuit device and manufacturing method | |
DE69903045T2 (en) | A MOVABLE DEVICE FOR SELECTIVELY REMOVING BRIDGES AND METHOD FOR REMOVING BRIDGES OF SOLDERED CONNECTIONS ON PRINTED CIRCUITS BY SUCH A DEVICE | |
US3813023A (en) | Desoldering device | |
US3815806A (en) | Desoldering fixture | |
EP1033197A3 (en) | Method and apparatus for soldering printed circuit boards and cooling mechanism for a soldering apparatus | |
MY129904A (en) | Apparatus and method for soldering electronic components to printed circuit boards | |
JPS57100867A (en) | Method and device for soldering | |
JP2730688B2 (en) | Solder heating device | |
ATE22520T1 (en) | MODULAR CONTROL UNIT. | |
US5146694A (en) | Vapor reflow type soldering apparatus | |
JP2000188464A (en) | Automatic soldering device | |
JPS5554265A (en) | Reflow soldering method | |
US5647529A (en) | Method of controlling the temperature of a portion of an electronic part during solder reflow | |
US5478004A (en) | Automatic soldering apparatus | |
JPS5720441A (en) | Exchanging device for semiconductor element | |
JPH11307918A (en) | Bonding equipment | |
JPS5480255A (en) | Soldering method | |
KR890004714Y1 (en) | Exhacting apparatus of inferior ic | |
SU1590242A1 (en) | Method of soldering elements with radioelectronic equipment | |
JPS5932913B2 (en) | How to firmly solder components to a double-sided wiring board | |
SU1680452A1 (en) | Method of soldering microcircuit leads to printed-circuit boards | |
JP2004071785A (en) | Jet soldering equipment | |
JPS5699072A (en) | Soldering device |