JPS57100867A - Method and device for soldering - Google Patents

Method and device for soldering

Info

Publication number
JPS57100867A
JPS57100867A JP55177206A JP17720680A JPS57100867A JP S57100867 A JPS57100867 A JP S57100867A JP 55177206 A JP55177206 A JP 55177206A JP 17720680 A JP17720680 A JP 17720680A JP S57100867 A JPS57100867 A JP S57100867A
Authority
JP
Japan
Prior art keywords
terminals
land
block
liquid
leading end
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP55177206A
Other languages
Japanese (ja)
Other versions
JPS58951B2 (en
Inventor
Minoru Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NIHON TSUUSHIN GIJUTSU KK
NIPPON TSUSHIN GIJUTSU KK
Original Assignee
NIHON TSUUSHIN GIJUTSU KK
NIPPON TSUSHIN GIJUTSU KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NIHON TSUUSHIN GIJUTSU KK, NIPPON TSUSHIN GIJUTSU KK filed Critical NIHON TSUUSHIN GIJUTSU KK
Priority to JP55177206A priority Critical patent/JPS58951B2/en
Publication of JPS57100867A publication Critical patent/JPS57100867A/en
Publication of JPS58951B2 publication Critical patent/JPS58951B2/en
Expired legal-status Critical Current

Links

Abstract

PURPOSE: To perform the work of soldering the terminals of integrated circuits to the land of a printed wiring board efficiently and improve reliability by supplying heat to objects to be soldered by means of heated liquid as a heating medium.
CONSTITUTION: The respective terminals of an integrated circuit 1 to be soldered are positioned to the corresponding positions of a land 4 provided to a printed wiring board 3, and when an arm 12 supporting a block 15 for thermal pressure welding is lowered, the leading end of the block 15 contacts the terminals 2 mechanically. Liquid 19 is injected into the block 15 through a liquid injection port 18, for the former of which the liquid which evaporates less or does not evaporate at the melting temp. of the solder when heated in passing through a flow passage is used. When the leading end of the block 15 contacts the terminals 2, the heated liquid flows out through the opening at the leading end to around the terminals 2, and by the heat thereof, the solder stuck on the surfaces of the terminals 2 and the land 4 is melted, whereby the soldering of the terminals 2 arrayed in one row and the land 4 is accomplished at one time.
COPYRIGHT: (C)1982,JPO&Japio
JP55177206A 1980-12-17 1980-12-17 Soldering method and soldering equipment Expired JPS58951B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55177206A JPS58951B2 (en) 1980-12-17 1980-12-17 Soldering method and soldering equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55177206A JPS58951B2 (en) 1980-12-17 1980-12-17 Soldering method and soldering equipment

Publications (2)

Publication Number Publication Date
JPS57100867A true JPS57100867A (en) 1982-06-23
JPS58951B2 JPS58951B2 (en) 1983-01-08

Family

ID=16027023

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55177206A Expired JPS58951B2 (en) 1980-12-17 1980-12-17 Soldering method and soldering equipment

Country Status (1)

Country Link
JP (1) JPS58951B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61232058A (en) * 1985-04-09 1986-10-16 Kenji Kondo Jointing method of articles by welding

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4943638A (en) * 1972-08-29 1974-04-24
JPS5039137A (en) * 1973-08-09 1975-04-11
JPS5099138A (en) * 1973-12-28 1975-08-06
JPS50127631A (en) * 1974-03-14 1975-10-07
JPS51135533A (en) * 1975-05-19 1976-11-24 Fuji Photo Film Co Ltd Sound recording device of sound movie camera
JPS55102991A (en) * 1979-02-01 1980-08-06 Alps Electric Co Ltd Adjusting device for directivity of microphone

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5086455A (en) * 1973-12-07 1975-07-11
JPS5319563A (en) * 1976-08-05 1978-02-22 Nippon Aviotronics Kk Method and device for soldering integrated circuit

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4943638A (en) * 1972-08-29 1974-04-24
JPS5039137A (en) * 1973-08-09 1975-04-11
JPS5099138A (en) * 1973-12-28 1975-08-06
JPS50127631A (en) * 1974-03-14 1975-10-07
JPS51135533A (en) * 1975-05-19 1976-11-24 Fuji Photo Film Co Ltd Sound recording device of sound movie camera
JPS55102991A (en) * 1979-02-01 1980-08-06 Alps Electric Co Ltd Adjusting device for directivity of microphone

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61232058A (en) * 1985-04-09 1986-10-16 Kenji Kondo Jointing method of articles by welding

Also Published As

Publication number Publication date
JPS58951B2 (en) 1983-01-08

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