JPS569750U - - Google Patents

Info

Publication number
JPS569750U
JPS569750U JP8916079U JP8916079U JPS569750U JP S569750 U JPS569750 U JP S569750U JP 8916079 U JP8916079 U JP 8916079U JP 8916079 U JP8916079 U JP 8916079U JP S569750 U JPS569750 U JP S569750U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8916079U
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8916079U priority Critical patent/JPS569750U/ja
Publication of JPS569750U publication Critical patent/JPS569750U/ja
Pending legal-status Critical Current

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Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP8916079U 1979-06-29 1979-06-29 Pending JPS569750U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8916079U JPS569750U (ja) 1979-06-29 1979-06-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8916079U JPS569750U (ja) 1979-06-29 1979-06-29

Publications (1)

Publication Number Publication Date
JPS569750U true JPS569750U (ja) 1981-01-27

Family

ID=29322326

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8916079U Pending JPS569750U (ja) 1979-06-29 1979-06-29

Country Status (1)

Country Link
JP (1) JPS569750U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04138478U (ja) * 1991-06-11 1992-12-25 東陶機器株式会社 便器の排水管接続構造

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53126276A (en) * 1977-04-11 1978-11-04 Nippon Telegr & Teleph Corp <Ntt> Heat dissipation construction of multichip mounting substrate

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53126276A (en) * 1977-04-11 1978-11-04 Nippon Telegr & Teleph Corp <Ntt> Heat dissipation construction of multichip mounting substrate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04138478U (ja) * 1991-06-11 1992-12-25 東陶機器株式会社 便器の排水管接続構造

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