JPS5695050U - - Google Patents
Info
- Publication number
- JPS5695050U JPS5695050U JP17807279U JP17807279U JPS5695050U JP S5695050 U JPS5695050 U JP S5695050U JP 17807279 U JP17807279 U JP 17807279U JP 17807279 U JP17807279 U JP 17807279U JP S5695050 U JPS5695050 U JP S5695050U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Fuses (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17807279U JPS629639Y2 (enExample) | 1979-12-21 | 1979-12-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17807279U JPS629639Y2 (enExample) | 1979-12-21 | 1979-12-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5695050U true JPS5695050U (enExample) | 1981-07-28 |
| JPS629639Y2 JPS629639Y2 (enExample) | 1987-03-06 |
Family
ID=29688629
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17807279U Expired JPS629639Y2 (enExample) | 1979-12-21 | 1979-12-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS629639Y2 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60147143U (ja) * | 1984-03-09 | 1985-09-30 | 株式会社明電舎 | 限流フユ−ズ |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100379089B1 (ko) | 1999-10-15 | 2003-04-08 | 앰코 테크놀로지 코리아 주식회사 | 리드프레임 및 이를 이용한 반도체패키지 |
| US7361533B1 (en) | 2002-11-08 | 2008-04-22 | Amkor Technology, Inc. | Stacked embedded leadframe |
| US6905914B1 (en) | 2002-11-08 | 2005-06-14 | Amkor Technology, Inc. | Wafer level package and fabrication method |
| US7572681B1 (en) | 2005-12-08 | 2009-08-11 | Amkor Technology, Inc. | Embedded electronic component package |
| US8937381B1 (en) | 2009-12-03 | 2015-01-20 | Amkor Technology, Inc. | Thin stackable package and method |
| US8324511B1 (en) | 2010-04-06 | 2012-12-04 | Amkor Technology, Inc. | Through via nub reveal method and structure |
| US8440554B1 (en) | 2010-08-02 | 2013-05-14 | Amkor Technology, Inc. | Through via connected backside embedded circuit features structure and method |
| US8487445B1 (en) | 2010-10-05 | 2013-07-16 | Amkor Technology, Inc. | Semiconductor device having through electrodes protruding from dielectric layer |
| US8552548B1 (en) | 2011-11-29 | 2013-10-08 | Amkor Technology, Inc. | Conductive pad on protruding through electrode semiconductor device |
-
1979
- 1979-12-21 JP JP17807279U patent/JPS629639Y2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60147143U (ja) * | 1984-03-09 | 1985-09-30 | 株式会社明電舎 | 限流フユ−ズ |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS629639Y2 (enExample) | 1987-03-06 |