JPS5694693A - Printed circuit board - Google Patents

Printed circuit board

Info

Publication number
JPS5694693A
JPS5694693A JP17069879A JP17069879A JPS5694693A JP S5694693 A JPS5694693 A JP S5694693A JP 17069879 A JP17069879 A JP 17069879A JP 17069879 A JP17069879 A JP 17069879A JP S5694693 A JPS5694693 A JP S5694693A
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
printed
board
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17069879A
Other languages
Japanese (ja)
Inventor
Katsutoshi Soejima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP17069879A priority Critical patent/JPS5694693A/en
Publication of JPS5694693A publication Critical patent/JPS5694693A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Wire Bonding (AREA)
JP17069879A 1979-12-27 1979-12-27 Printed circuit board Pending JPS5694693A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17069879A JPS5694693A (en) 1979-12-27 1979-12-27 Printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17069879A JPS5694693A (en) 1979-12-27 1979-12-27 Printed circuit board

Publications (1)

Publication Number Publication Date
JPS5694693A true JPS5694693A (en) 1981-07-31

Family

ID=15909730

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17069879A Pending JPS5694693A (en) 1979-12-27 1979-12-27 Printed circuit board

Country Status (1)

Country Link
JP (1) JPS5694693A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6045459U (en) * 1983-09-06 1985-03-30 松下電器産業株式会社 Wiring body for thick film hybrid circuit
JPS6486525A (en) * 1987-09-29 1989-03-31 Toshiba Corp Electronic circuit component
JP2020178059A (en) * 2019-04-19 2020-10-29 ハイソル株式会社 Wire bonding method and semiconductor chip wiring structure

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6045459U (en) * 1983-09-06 1985-03-30 松下電器産業株式会社 Wiring body for thick film hybrid circuit
JPS6486525A (en) * 1987-09-29 1989-03-31 Toshiba Corp Electronic circuit component
JP2020178059A (en) * 2019-04-19 2020-10-29 ハイソル株式会社 Wire bonding method and semiconductor chip wiring structure

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