JPS5690575A - Coaxial diode - Google Patents

Coaxial diode

Info

Publication number
JPS5690575A
JPS5690575A JP16794179A JP16794179A JPS5690575A JP S5690575 A JPS5690575 A JP S5690575A JP 16794179 A JP16794179 A JP 16794179A JP 16794179 A JP16794179 A JP 16794179A JP S5690575 A JPS5690575 A JP S5690575A
Authority
JP
Japan
Prior art keywords
chip
cause
parallel
header
relation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16794179A
Other languages
Japanese (ja)
Inventor
Haruo Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Toyo Electronics Industry Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd, Toyo Electronics Industry Corp filed Critical Rohm Co Ltd
Priority to JP16794179A priority Critical patent/JPS5690575A/en
Publication of JPS5690575A publication Critical patent/JPS5690575A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)

Abstract

PURPOSE:To provide p-n junction plane of a thick chip in parallel with a header surface by a method wherein a height of a diode chip, side length, a diametral length of the end surface or side surface thereof are kept at a desired relation. CONSTITUTION:Side length of the end surface of the chip 4 is W, and a height of the chip is H, 2<1/2> W<D<(H<2>+W<2>)<1/2> should be required so as to cause the chip to be placed in a glass pipe (its inner diameter is D) and to cause the planes of headers 5 and 6 to be in parallel with p-n junction plane 7. A relation of HW/(H<2>+ W<2>)<1/2>>d/2 should be kept so as to cause the inclined chip to be recovered in the pipe, where a distance between the vertical walls A and B is d. When this relation is fulfilled, even if the chip is dropped into the glass tube 1 with being inclined therein, the chip 4 may recover from its inclined condition with the surface of the header 5, resulting in that the p-n junction plane is set to be parallel with the header surface. Thereafter, a thick chip may be used to expand its bright surface.
JP16794179A 1979-12-24 1979-12-24 Coaxial diode Pending JPS5690575A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16794179A JPS5690575A (en) 1979-12-24 1979-12-24 Coaxial diode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16794179A JPS5690575A (en) 1979-12-24 1979-12-24 Coaxial diode

Publications (1)

Publication Number Publication Date
JPS5690575A true JPS5690575A (en) 1981-07-22

Family

ID=15858883

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16794179A Pending JPS5690575A (en) 1979-12-24 1979-12-24 Coaxial diode

Country Status (1)

Country Link
JP (1) JPS5690575A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1070288A (en) * 1996-07-23 1998-03-10 Zowie Technol Corp Silicon semiconductor diode chip having full-open p-n junction subjected to passivation with glass, and fabrication thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1070288A (en) * 1996-07-23 1998-03-10 Zowie Technol Corp Silicon semiconductor diode chip having full-open p-n junction subjected to passivation with glass, and fabrication thereof

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