JPS569013B2 - - Google Patents
Info
- Publication number
- JPS569013B2 JPS569013B2 JP12054276A JP12054276A JPS569013B2 JP S569013 B2 JPS569013 B2 JP S569013B2 JP 12054276 A JP12054276 A JP 12054276A JP 12054276 A JP12054276 A JP 12054276A JP S569013 B2 JPS569013 B2 JP S569013B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12054276A JPS5345973A (en) | 1976-10-06 | 1976-10-06 | Resin-sealing-type semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12054276A JPS5345973A (en) | 1976-10-06 | 1976-10-06 | Resin-sealing-type semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5345973A JPS5345973A (en) | 1978-04-25 |
| JPS569013B2 true JPS569013B2 (enExample) | 1981-02-26 |
Family
ID=14788862
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12054276A Granted JPS5345973A (en) | 1976-10-06 | 1976-10-06 | Resin-sealing-type semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5345973A (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5555550A (en) * | 1978-10-18 | 1980-04-23 | Nec Kyushu Ltd | Semiconductor device |
| JPS60195878U (ja) * | 1984-06-05 | 1985-12-27 | 三菱電機株式会社 | エレベ−タ用冷房装置の排水装置 |
-
1976
- 1976-10-06 JP JP12054276A patent/JPS5345973A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5345973A (en) | 1978-04-25 |