JPS5684360U - - Google Patents
Info
- Publication number
- JPS5684360U JPS5684360U JP1979167257U JP16725779U JPS5684360U JP S5684360 U JPS5684360 U JP S5684360U JP 1979167257 U JP1979167257 U JP 1979167257U JP 16725779 U JP16725779 U JP 16725779U JP S5684360 U JPS5684360 U JP S5684360U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/884—
-
- H10W90/756—
Landscapes
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1979167257U JPS5684360U (enExample) | 1979-11-29 | 1979-11-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1979167257U JPS5684360U (enExample) | 1979-11-29 | 1979-11-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5684360U true JPS5684360U (enExample) | 1981-07-07 |
Family
ID=29678123
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1979167257U Pending JPS5684360U (enExample) | 1979-11-29 | 1979-11-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5684360U (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6367260U (enExample) * | 1986-10-21 | 1988-05-06 | ||
| JPH01238128A (ja) * | 1988-03-18 | 1989-09-22 | Nec Corp | 樹脂封止型半導体装置 |
| JP2012253390A (ja) * | 2012-09-24 | 2012-12-20 | Renesas Electronics Corp | 半導体装置の製造方法 |
-
1979
- 1979-11-29 JP JP1979167257U patent/JPS5684360U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6367260U (enExample) * | 1986-10-21 | 1988-05-06 | ||
| JPH01238128A (ja) * | 1988-03-18 | 1989-09-22 | Nec Corp | 樹脂封止型半導体装置 |
| JP2012253390A (ja) * | 2012-09-24 | 2012-12-20 | Renesas Electronics Corp | 半導体装置の製造方法 |