JPS5681546U - - Google Patents
Info
- Publication number
- JPS5681546U JPS5681546U JP16436479U JP16436479U JPS5681546U JP S5681546 U JPS5681546 U JP S5681546U JP 16436479 U JP16436479 U JP 16436479U JP 16436479 U JP16436479 U JP 16436479U JP S5681546 U JPS5681546 U JP S5681546U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16436479U JPS5681546U (enExample) | 1979-11-27 | 1979-11-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16436479U JPS5681546U (enExample) | 1979-11-27 | 1979-11-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5681546U true JPS5681546U (enExample) | 1981-07-01 |
Family
ID=29675308
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16436479U Pending JPS5681546U (enExample) | 1979-11-27 | 1979-11-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5681546U (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0332046A (ja) * | 1989-06-28 | 1991-02-12 | Mitsubishi Electric Corp | 半導体装置 |
| WO2020188617A1 (ja) * | 2019-03-15 | 2020-09-24 | 三菱電機株式会社 | 半導体装置、及び冷却用部材付き半導体装置 |
| JP2022065238A (ja) * | 2020-10-15 | 2022-04-27 | 富士電機株式会社 | 半導体装置 |
-
1979
- 1979-11-27 JP JP16436479U patent/JPS5681546U/ja active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0332046A (ja) * | 1989-06-28 | 1991-02-12 | Mitsubishi Electric Corp | 半導体装置 |
| WO2020188617A1 (ja) * | 2019-03-15 | 2020-09-24 | 三菱電機株式会社 | 半導体装置、及び冷却用部材付き半導体装置 |
| JPWO2020188617A1 (ja) * | 2019-03-15 | 2021-10-14 | 三菱電機株式会社 | 半導体装置、及び冷却用部材付き半導体装置 |
| CN113557602A (zh) * | 2019-03-15 | 2021-10-26 | 三菱电机株式会社 | 半导体装置、及附带冷却用部件的半导体装置 |
| US12074088B2 (en) | 2019-03-15 | 2024-08-27 | Mitsubishi Electric Corporation | Semiconductor device and semiconductor device with cooling member |
| JP2022065238A (ja) * | 2020-10-15 | 2022-04-27 | 富士電機株式会社 | 半導体装置 |