JPS567353U - - Google Patents
Info
- Publication number
- JPS567353U JPS567353U JP8803679U JP8803679U JPS567353U JP S567353 U JPS567353 U JP S567353U JP 8803679 U JP8803679 U JP 8803679U JP 8803679 U JP8803679 U JP 8803679U JP S567353 U JPS567353 U JP S567353U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8803679U JPS567353U (en) | 1979-06-27 | 1979-06-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8803679U JPS567353U (en) | 1979-06-27 | 1979-06-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS567353U true JPS567353U (en) | 1981-01-22 |
Family
ID=29321231
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8803679U Pending JPS567353U (en) | 1979-06-27 | 1979-06-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS567353U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63136790U (en) * | 1987-02-26 | 1988-09-08 | ||
| JP2009212371A (en) * | 2008-03-05 | 2009-09-17 | Mitsubishi Electric Corp | Circuit apparatus |
| JPWO2015025447A1 (en) * | 2013-08-23 | 2017-03-02 | 富士電機株式会社 | Semiconductor device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53126276A (en) * | 1977-04-11 | 1978-11-04 | Nippon Telegr & Teleph Corp <Ntt> | Heat dissipation construction of multichip mounting substrate |
-
1979
- 1979-06-27 JP JP8803679U patent/JPS567353U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53126276A (en) * | 1977-04-11 | 1978-11-04 | Nippon Telegr & Teleph Corp <Ntt> | Heat dissipation construction of multichip mounting substrate |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63136790U (en) * | 1987-02-26 | 1988-09-08 | ||
| JP2009212371A (en) * | 2008-03-05 | 2009-09-17 | Mitsubishi Electric Corp | Circuit apparatus |
| JPWO2015025447A1 (en) * | 2013-08-23 | 2017-03-02 | 富士電機株式会社 | Semiconductor device |
| US9842786B2 (en) | 2013-08-23 | 2017-12-12 | Fuji Electric Co., Ltd. | Semiconductor device |